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US 9,070,393 B2Granted
Three-dimensional structure in which wiring is provided on its surface
AssigneePanasonic Corporation
InventorsShingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
Life of this patent
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Abstract
One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.
Claims2
A three-dimensional structure in which a wiring is provided on a surface, comprising:
- an insulating resin layer that contains a filler comprising at least one element selected from typical non-metal elements and typical metal elements,
- wherein a recessed wiring gutter is provided in a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed wiring gutter,
- wherein an average particle size of the filler is equal to or less than 1/2 of a width of the recessed wiring gutter and is 0.01 μm to 10 μm.
Dependencies are inferred from the claim text.