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US 9,070,071 B2Granted
Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereof
AssigneeMtekvision Co., Ltd.
InventorsDong-Hyun Baek, Byoung-Ok Lee, Jung-Hyun Cho, Eun-Su Kim
Life of this patent
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Abstract
A card-type information recording medium including a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process, an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB, and a molding material that is formed on the top of the PCB so as to cover the NFC communication unit and the USIM card unit.
Claims6
A card-type information recording medium comprising:
- a PCB that has a loop antenna pattern and a routing pattern formed on a top surface and a bottom surface thereof through use of an etching process;
- an NFC communication unit and a USIM card unit that are horizontally mounted on the top surface of the PCB;
- a molding material that is formed on the top surface of the PCB so as to cover the NFC communication unit and the USIM card unit;
- and
- a ferrite sheet disposed in the molding material over the top surface of the PCB so as to be separated from the NFC communication unit and the USIM card unit by a portion of the molding material,
- wherein the ferrite sheet further covers the NFC communication unit and the USIM card unit over the top surface of the PCB.
3 more elements
A method of manufacturing a card-type information recording medium, comprising:
- forming a conductor on a top surface and a bottom surface of a PCB and then forming a loop antenna pattern and a routing pattern on the top surface and the bottom surface through use of an etching process;
- horizontally mounting an NFC communication unit and a USIM card unit on the top surface of the PCB;
- and
- covering the top surface of the PCB with a molding material so as to receive the NFC communication unit and the USIM card unit therein,
- wherein the covering of the top surface of the PCB includes:
- firstly covering the top surface of the PCB with the molding material so as to receive the NFC communication unit and the USIM card unit therein;
- disposing a ferrite sheet on a top surface of the molding material so as to be separated from the NFC communication unit and the USIM card unit by a portion of the molding material, wherein the ferrite sheet further covers the NFC communication unit and the USIM card unit over the top surface of the PCB;
- and
- secondly covering a top surface of the ferrite sheet so as to receive the ferrite sheet therein.
6 more elements
Dependencies are inferred from the claim text.