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US 9,070,066 B1Granted
RFID tags with inductively coupled antennas
AssigneeImpinj, Inc.
InventorsRon Oliver, Harley Heinrich, Ron Koepp, Christopher Diorio
Life of this patent
Estimating the term…
Abstract
A Radio Frequency Identification (RFID) assembly includes an IC, a repassivation layer disposed on the IC, and an inductor disposed on the repassivation layer. The IC includes a gapped seal ring. The inductor may couple to an RFID tag antenna, thereby allowing the IC to transmit and receive RF signals.
Claims20
A Radio Frequency Identification (RFID) assembly comprising:
- an integrated circuit (IC) including a circuit block, a first antenna port coupled to the circuit block and including at least two antenna contacts, and a gapped seal ring surrounding the circuit block;
- a nonconductive repassivation layer deposited on the IC and confined within a perimeter of the IC;
- and
- an inductor disposed on the nonconductive repassivation layer, wherein the inductor is:
- confined within a perimeter of the nonconductive repassivation layer, and
- electrically coupled to the at least two antenna contacts through at least one of a via through, and a sidewall connection around, the nonconductive repassivation layer.
3 more elements
A Radio Frequency Identification (RFID) tag comprising:
- a tag substrate including an antenna;
- and
- an RFID assembly including:
- an integrated circuit (IC) including a circuit block, a first antenna port coupled to the circuit block and including at least two antenna contacts, and a gapped seal ring surrounding the circuit block;
- a nonconductive repassivation layer deposited on the IC and confined within a perimeter of the IC;
- and
- an inductor disposed on the nonconductive repassivation layer, wherein the inductor is:
- confined within a perimeter of the nonconductive repassivation layer;
- and
- electrically coupled to the at least two antenna contacts through at least one of a via through, and a sidewall connection around, the nonconductive repassivation layer, wherein:
- the assembly is joined with the tag substrate such that the inductor is electrically coupled to the antenna.
8 more elements
A method for assembling a Radio Frequency Identification (RFID) tag, the method comprising:
- providing a tag substrate including an antenna;
- providing an RFID assembly including:
- an integrated circuit (IC) including a circuit block, a first antenna port coupled to the circuit block and including at least two antenna contacts, and a gapped seal ring surrounding the circuit block;
- a nonconductive repassivation layer disposed on the IC and confined within a perimeter of the IC;
- and
- an inductor disposed on the nonconductive repassivation layer, wherein the inductor is:
- confined within a perimeter of the nonconductive repassivation layer;
- and
- electrically coupled to the at least two antenna contacts through at least one of a via through, and a sidewall connection around, the nonconductive repassivation layer;
- and
- joining the assembly to the tag substrate such that the inductor is electrically coupled to the antenna.
8 more elements
Dependencies are inferred from the claim text.