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US 9,070,063 B2Granted
Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
AssigneeRuizhang Technology Limited Company
InventorCurt Carrender
Life of this patent
Estimating the term…
Abstract
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.
Claims20
A device comprising:
- a first substrate layer;
- a metallization layer formed on a surface of the first substrate layer, wherein the metallization layer comprises a first slot to expose a portion of the first substrate layer;
- wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;
- a radio frequency identification (RFID) chip over the portion of the first substrate layer;
- a conductive layer which couples the RFID chip to the metallization layer,
- wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.
3 more elements
A method for creating a device comprising:
- forming a first slot in a metallization layer to expose a portion of a surface of a first substrate layer;
- wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;
- depositing a radio frequency identification (RFID) chip over the portion of the first substrate layer;
- coupling the RFID chip to the metallization layer by a conductive layer which extends from the RFID chip to the metallization layer, wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.
1 more element
Dependencies are inferred from the claim text.