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US 9,069,923 B2Granted
IP protection
AssigneesGlobalfoundries Singapore Pte. Ltd., International Business Machines Corporation, Renesas Electronics Corporation
InventorsSoon Yoeng Tan, Teck Jung Tang, Ian D. Melville, Yelei Vianna Yao, Yasushi Yamagata
Life of this patent
Estimating the term…
Abstract
Multi-Project Wafers includes a plurality of chiplets from different IP owners. Non-relevant chiplets are implemented with IP protection to inhibit IP disclosure of non-relevant IP owners.
Claims19
A method of forming a device comprising:
- providing a substrate with a device layer;
- providing a MPW mask comprising first and second patterns of first and second chiplets pertaining to first and second IP owners, the MPW mask is used to form a device for the first IP owner, wherein the first pattern of the first chiplet is according to that of the first IP owner and the second pattern of the second chiplet is a modified second pattern, the modified second pattern is different from that according to the second IP owner to protect IP information of the second IP owner from disclosure to the first IP owner;
- providing an exposure source to expose the substrate using the MPW mask without providing a cover on the MPW mask over the second chiplet;
- patterning the device layer in first and second chiplet regions after the exposure, wherein the first pattern of the first chiplet is transferred to the device layer and the second pattern with IP protection of the second chiplet is transferred to the device layer;
- delivering the device to the first IP owner, the device includes first and second chiplets, wherein the second chiplet includes IF protection to reduce disclosure of IP information of the second IP owner to the first IP owner;
- and
- continue processing of the device to form the desired function of the device.
4 more elements
A method of forming a device comprising:
- providing a MPW mask comprising first and second patterns of first and second chiplets pertaining to first and second IP owners, the PAM mask is used to form a device for the first IP owner, wherein the first pattern of the first chiplet is according to that of the first IP owner and the second pattern of the second chiplet is a modified second pattern, the modified second pattern is different from that according to the second IP owner to protect IP information of the second IP owner from disclosure to the first IP owner;
- forming a resist layer on a substrate with a device layer;
- performing a first exposure on the resist layer with the MPW mask without providing a cover on the MPW mask over the second chiplet to form a patterned resist layer containing first and second patterns of first and second chiplets;
- patterning the device layer in first and second chiplet regions using the patterned resist layer, wherein the first pattern of the first chiplet is transferred to the device layer and the second pattern with IP protection of the second chiplet is transferred to the device layer;
- performing additional processing to complete forming the device;
- and
- delivering the device to the first IP owner, the device includes first and second chiplets, wherein the second chiplet includes IP protection to reduce disclosure of IP information of the second IP owner to the first IP owner.
4 more elements
Dependencies are inferred from the claim text.