Optical communication module and method for making the same
AssigneeRohm Co., Ltd.
InventorAkira Obika
Life of this patent
Estimating the term…
Abstract
An optical communication module according to the present invention includes an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, a first resin member which covers the optical semiconductor element and is made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member which covers the first resin member. A portion of the first resin member is exposed from the second resin member. The optical communication module further includes an attachment hole for attaching an optical fiber. The attachment hole includes an opening that opens at the portion of the first resin member which is exposed from the second resin member.
Claims19
An optical communication module comprising:
- an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function;
- a first resin member covering the optical semiconductor element, the first resin member being made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region;
- a second resin member covering the first resin member;
- and
- a main substrate comprising an obverse surface and a reverse surface, the obverse surface being in contact with the second resin member;
- wherein
- the optical communication module further comprises an attachment hole for attaching an optical fiber, the attachment hole including an opening that opens at a portion of the first resin member which is exposed from the second resin member,
- the first resin member comprises an opening end surface at which the opening of the attachment hole is open, and
- the main substrate comprises a substrate end surface that is flush with the opening end surface of the resin member.
A method for making an optical communication module, the method comprising the steps of:
- forming a first resin intermediate product by covering an optical semiconductor element with a resin, the optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, the resin transmitting light emitted from the optical function region or light to be received by the optical function region;
- forming a preliminary hole in the first resin intermediate product;
- attaching a sealing sheet to the first resin intermediate product to close the preliminary hole;
- forming a second resin intermediate product by covering the first resin intermediate product and the sealing sheet with a resin;
- and
- forming a first resin member, a second resin member and an attachment hole by collectively removing the sealing sheet, a part of the first resin intermediate product and a part of the second resin intermediate product, the first resin member covering the optical semiconductor element, the second resin member exposing a portion of the first resin member while covering remaining portions of the first resin member, the attachment hole including an opening that opens at the portion of the first resin member which is exposed from the second resin member.
Dependencies are inferred from the claim text.