Interface board of a testing head for a test equipment of electronic devices and corresponding probe head

An interface board of a testing head for a test equipment of electronic devices, the testing head comprising a plurality of contact probes, each contact probe having a contact tip and a contact element, the contact tip being suitable to abut against contact pads of a device to be tested, the contact element being suitable to connect with a board of the test equipment, wherein the interface board comprises:

• a substrate;
• a parallel testing module housed on a first surface of the substrate;
• and
• a plurality of contact pins projecting from a second surface of the substrate opposite to the first surface and suitable to contact the board, the parallel testing module including in turn:
• a substrate;
• and
• a plurality of redirecting dice arranged as a matrix and suitably spaced from each other by separation passages, each redirecting die comprising a semiconductor substrate whereon
• at least a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, wherein, for each redirecting die:
• the contact pads of the first plurality of the redirecting die are distributed in a central portion of the redirecting die with a spatial distribution substantially corresponding to a spatial distribution of a plurality of contact pads of the device to be tested;
• and
• a second plurality of contact pads is distributed in a peripheral portion of the redirecting die and connected to the contact pads of the first plurality of the redirecting die by a plurality of metallic interconnection tracks realized in the redirecting die, the peripheral portion surrounding the central portion.

A testing head for a test equipment of electronic devices comprising a plurality of contact probes, each contact probe having a contact tip and a contact element, the contact tip being suitable to abut against contact pads of a device to be tested, the contact element being suitable to connect with a board of the test equipment, the testing head comprising at least one interface board including in turn:

• a substrate;
• a redirecting die housed on a first surface of the substrate;
• and
• a plurality of contact pins projecting from a second surface of the substrate opposite to the first surface and suitable to contact the board, the redirecting die comprising a semiconductor substrate whereon a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, wherein:
• the contact pads of the first plurality are distributed in a central portion of the redirecting die with a spatial distribution substantially corresponding to a spatial distribution of a plurality of contact pads of the device to be tested;
• and
• the interface board further comprises a second plurality of contact pads distributed in a peripheral portion of the redirecting die and connected to the contact pads of the first plurality by a plurality of metallic interconnection tracks realized in the substrate of the redirecting die, the peripheral portion surrounding the central portion.

A testing head for a test equipment of electronic devices comprising a plurality of contact probes, each contact probe having a contact tip and a contact element, the contact tip being suitable to abut against contact pads of a device to be tested, the contact element being suitable to connect with a board of the test equipment, the testing head comprising an interface board including in turn:

• a substrate;
• a parallel testing module housed on a first surface of the substrate;
• and
• a plurality of contact pins projecting from a second surface of the substrate opposite to the first surface and suitable to contact the board, the parallel testing module including in turn:
• a substrate;
• and
• a plurality of redirecting dice arranged as a matrix and suitably spaced from each other by separation passages, each redirecting die comprising a semiconductor substrate whereon
• a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, wherein, for each redirecting die:
• the contact pads of the first plurality of the redirecting die are distributed in a central portion of the redirecting die with a spatial distribution substantially corresponding to a spatial distribution of a plurality of contact pads of the device to be tested;
• and
• a second plurality of contact pads is distributed in a peripheral portion of the redirecting die and connected to the contact pads of the first plurality of the redirecting die by a plurality of metallic interconnection tracks realized in the redirecting die, the peripheral portion surrounding the central portion.