Inspection apparatus for semiconductor devices and chuck stage for the inspection apparatus that is movable with respect to the front and back side electrodes

An inspection apparatus for semiconductor devices, which comprises;

• probes for front side electrodes, probes for back side electrodes, a chuck stage which relatively moves with respect to the probes for front side electrodes and the probes for back side electrodes, a wafer holding area which holds a wafer to be inspected, and a probe contact area which is conductive and covers an area having the same size and the same shape as the largest wafer to be held on the wafer holding area,
• wherein, the wafer holding area and the probe contact area are formed on the upper surface of the chuck stage close to each other but without overlapping of the areas, the wafer holding area has conductive contact parts which are to be in contact with the back side of the wafer, and the probe contact area electrically continues to the conductive contact parts of the wafer holding area through conductive parts of the wafer holding area and the upper surface of the chuck stage other than the probe contact area, and,
• wherein the probes for front side electrodes and the probes for back side electrodes are placed leaving a distance in horizontal direction between them so that the probes for back side electrodes relatively move within the probe contact area when the probes for front side electrodes are relatively moved within the wafer under test by the movement of the chuck stage.