Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation
AssigneeSkyworks Solutions, Inc.
InventorKezia Cheng
Life of this patent
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Abstract
Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, the deposition is completed and the system is inspected for contamination.
Claims20
A system for detecting impurities in a metal slug from which metal is evaporated during operation of an electron-beam metal evaporation and deposition apparatus, the system comprising:
- an electrode to be positioned within a vacuum chamber of the electron-beam metal evaporation and deposition apparatus and to collect electrons backscattered from the metal slug;
- one or more insulating standoffs to support the electrode in a position in which there is an unobstructed straight line path between a portion of the electrode and a surface of the metal slug and to provide an unobstructed straight line path between a surface of the metal slug and a wafer positioned for processing in the electron-beam metal evaporation and deposition apparatus;
- an electrical meter to receive a first signal from the electrode and output a second signal responsive to the receipt of the first signal;
- and
- a controller programmed to receive the second signal from the electrical meter and provide an indication of an impurity concentration in the metal slug responsive to a characteristic of the second signal.
A system for detecting impurities in a metal slug from which metal is evaporated during operation of an electron-beam metal evaporation and deposition apparatus, the system comprising:
- means for collecting electrons backscattered from the metal slug;
- one or more insulating standoffs that support the means for collecting electrons backscattered from the metal slug in a position in which there is an unobstructed straight line path between a surface of the metal slug and a wafer positioned for processing in a vacuum chamber of the electron-beam metal evaporation and deposition apparatus;
- and
- a controller programmed to receive a signal from the means for collecting electrons backscattered from the metal slug and to provide an indication of an impurity concentration in the metal slug responsive to a characteristic of the signal.
A method for increasing the production yield of a semiconductor manufacturing process utilizing an electron-beam metal evaporation and deposition process, the method comprising:
- mounting an electrode within a vacuum chamber of an electron-beam metal evaporation and deposition apparatus in a position in which electrons backscattered from a metal slug during operation of the electron-beam metal evaporation and deposition apparatus will impact the electrode and generate a signal;
- and
- electrically coupling the electrode to a controller programmed to receive the signal from the electrode and provide an indication of an impurity concentration in the metal slug responsive to a characteristic of the signal.
Dependencies are inferred from the claim text.