Electroplating processor with thin membrane support
AssigneeApplied Materials, Inc.
InventorDaniel J. Woodruff
Life of this patent
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Abstract
An electroplating processor includes a thin lower membrane support for supporting a membrane. The lower membrane support may be provided as a flexible plastic sheet having a pattern of through-openings. The through-openings may be aligned with openings in a rigid upper membrane support. The perimeter of the lower membrane may be clamped in the same perimeter seal as used to clamp and seal the perimeter of the membrane. The lower membrane support supports the membrane without adding significantly to the overall height of the processor. The processor can be stacked in a two level processing system without requiring additional clean room space.
Claims11
An electroplating processor comprising:
- a bowl;
- a membrane in the bowl;
- an upper membrane support in the bowl above the membrane;
- and
- a lower membrane support in the bowl below the membrane, with the lower membrane support comprising a flexible sheet having a pattern of through openings.
An electroplating processor comprising:
- a membrane in a bowl;
- a rigid cup in the bowl above the membrane, with the rigid cup having a plurality of radial segments and through-openings between the segments;
- a lower membrane support in the bowl below the membrane, with the lower membrane support comprising a flexible sheet having a pattern of through openings;
- and a perimeter of the membrane overlying a perimeter of the lower membrane support, and with both perimeters clamped together at a perimeter of the bowl.
Dependencies are inferred from the claim text.