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US 9,068,100 B2Granted
Thermosetting resin composition, cured product thereof, and printed wiring board using the same
AssigneeTaiyo Ink Mfg. Co., Ltd.
InventorsArata Endo, Nobuhito Ito, Masao Arima
Life of this patent
Estimating the term…
Abstract
Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.
Claims17
A thermosetting resin composition, comprising:
- an epoxy resin;
- a curing agent for the epoxy resin;
- spherical silicon dioxide and/or spherical aluminum oxide;
- and
- a block copolymer,
- wherein the block copolymer has a weight average molecular weight, Mw, of 50000 or more and 300000 or less and a molecular weight distribution, Mw/Mn, of 3 or less, and the spherical silicon dioxide and/or spherical aluminum oxide are included in an amount of 50 wt % or more based on a total thermosetting resin composition.
3 more elements
A printed wiring board, comprising:
- a cured product prepared by heating and curing a thermosetting resin composition applied to a printed wiring board, or a film obtained by coating and drying a thermosetting resin composition onto a carrier film, applying the film to a printed wiring board, and heating and curing the film,
- wherein thermosetting resin composition comprises
- an epoxy resin,
- a curing agent for the epoxy resin,
- spherical silicon dioxide and/or spherical aluminum oxide, and
- a block copolymer having a weight average molecular weight, Mw, of 50000 or more and 300000 or less and a molecular weight distribution, Mw/Mn, of 3 or less.
3 more elements
Dependencies are inferred from the claim text.