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US 9,067,906 B2Granted
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
AssigneeHitachi Chemical Company, Ltd.
InventorsHayato Kotani, Naoyuki Urasaki, Makoto Mizutani
Life of this patent
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Abstract
The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.
Claims2
A polyvalent carboxylic acid condensate comprising a component represented by the following formula (X):
- (In formula (X), Rx represents a divalent group with an aliphatic hydrocarbon ring, wherein the aliphatic hydrocarbon ring is optionally substituted with a halogen atom or a straight-chain or branched hydrocarbon group, multiple Rx groups in the same molecule can be the same or different, and n represents an integer of 1 or greater.)
Dependencies are inferred from the claim text.