Method for manufacturing a hybrid integrated component
AssigneeRobert Bosch GmbH
InventorsJohannes Classen, Heribert Weber
Life of this patent
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Abstract
A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated.
Claims7
A method for manufacturing hybrid integrated components each having at least two MEMS elements, at least one ASIC element being assigned to each MEMS element, the method comprising:
- initially creating two MEMS/ASIC wafer stacks independently of one another, by performing the following:
- processing two ASIC substrates independently of one another;
- mounting a semiconductor substrate on the processed surface of each of the two ASIC substrates;
- and
- subsequently creating a micromechanical structure in each of the two semiconductor substrates;
- mounting the two MEMS/ASIC wafer stacks on top of each other, MEMS on MEMS;
- and
- subsequently separating the components.
Dependencies are inferred from the claim text.