Method for disassembling bonded body, and adhesive
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsHiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
Life of this patent
Estimating the term…
Abstract
Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.
Claims16
A method for disassembling a bonded body formed by bonding substrates with an adhesive having a storage elastic modulus of 1000 MPa or higher, comprising irradiating the bonded body with light having a wavelength of 280 nm or more such that irradiation energy is 10000-5000000 mJ/cm2 at a measured wavelength of 365 nm and while the bonded body is being heated to 150° C.-300° C.
Dependencies are inferred from the claim text.