Low temperature curable epoxy tape and method of making same

A method of making an epoxy tape comprising:

• dispersing a latent curative for epoxy resins in a binder layer comprising a scrim, wherein the binder layer has two opposing sides;
• drying the binder layer;
• and
• laminating an epoxy resin to each of the opposing sides of the binder layer, wherein the binder layer is not reactive with the latent curative even above its activation temperature.

A method of using an epoxy tape on an electronic device comprising:

• laminating an epoxy tape to a first electronic component to form a laminate;
• applying a second electronic component to the laminate to form an assembly;
• and
• heating the assembly to cure the epoxy tape,
• wherein the epoxy tape comprises a curative layer having a first side and a second opposing side, a first epoxy layer disposed upon the first side of the curative layer and a second epoxy layer disposed upon the second side of the curative layer, and
• wherein the curative layer comprises a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer, and wherein the binder layer is not reactive with the latent curative even above its activation temperature.