Method and device for permanent bonding of wafers, as well as cutting tool

Method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of:

• working one of a first bond surface and a second bond surface with a cutting tool to create a metastable structure in at least a near-surface area and to produce a reduced surface roughness of less than 100 nm,
• bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and
• exposing the solid substrates that are in contact to a temperature sufficient to form a permanent bond, said permanent bond being at least primarily produced by recrystallization at the bond surfaces down to a recrystallization depth R that is greater than the surface roughness O of the bond surfaces with a bond temperature TB that exceeds the recrystallization temperature.