US 9,067,342 B2Granted

Mold chase for integrated circuit package assembly and associated techniques and configurations

AssigneeIntel Corporation

InventorBogdan M. Simion

Life of this patent

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Abstract

Embodiments of the present disclosure are directed towards a mold chase for integrated circuit package assembly and associated techniques and configurations. In one embodiment, a method includes receiving a package substrate, the package substrate including a first die mounted on the package substrate by a plurality of first interconnect structures, and a plurality of second interconnect structures disposed on the package substrate and configured to route electrical signals of a second die, protecting a top surface of individual interconnect structures of the plurality of second interconnect structures from deposition of a mold material, and depositing the mold material on the package substrate between the individual interconnect structures of the plurality of second interconnect structures. Other embodiments may be described and/or claimed.

Claims10

Dependent claims

Fabrication equipment comprising:

a first portion configured to receive a package substrate for deposition of a mold material
a second portion coupled with the first portion;
a pin plate coupled with the second portion, the pin plate having a plurality of pins coupled to the pin plate and configured to correspond with a plurality of interconnect structures disposed on the package substrate, wherein the pin plate is configured to apply a force between individual pins of the plurality of pins and a top surface of individual interconnect structures of the plurality of interconnect structures to protect the top surface of the individual interconnect structures during deposition of the mold material;
and
a die compression plate coupled to the second portion and disposed between the pin plate and the first portion, the die compression plate having a compressive material that is configured to press against and protect a surface of the first die during deposition of the mold material.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/627,487Filed 26 Sep 2012
Published: US 2014/0084478 A127 Mar 2014
Granted: 30 Jun 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

H10W 90/00
Package configurations
B29C 37/0075
Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other:…
B29C 43/28
Of articles of indefinite length: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
H10W 20/069
Of conductive parts of the interconnections: by forming self-aligned vias or self-aligned contact plugs