Cutting device and cutting method of a liquid crystal panel
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorsDong Li, Feng She, Cheng-ming Huang
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Abstract
A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.
Claims13
A cutting method of a liquid crystal panel, the liquid crystal panel comprising a first substrate and a second substrate assembled together, characterized in that:
- the cutting method of the liquid crystal panel comprises the following steps:
- providing a cutting device of the liquid crystal panel, the cutting device of the liquid crystal panel comprising a first cutting portion and a second cutting portion, the second cutting portion including a support portion;
- controlling the first cutting portion to contact the first substrate and start to cut the first substrate, and simultaneously employing the support portion to support the first substrate;
- controlling the second cutting portion to contact the second substrate and start to cut the second substrate, and stopping the support portion supporting the first substrate.
A cutting device of a liquid crystal panel, the liquid crystal panel comprising a first substrate and a second substrate assembled together, the cutting device of the liquid crystal panel comprising a first cutting portion and a second cutting portion, the first cutting portion including a first cutter head for cutting the first substrate, the second cutting portion including a second cutter head for cutting the second substrate, characterized in that:
- the first cutter head and the second cutter head being staggered in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head being spaced a distance in a direction parallel to the liquid crystal panel;
- and
- the second cutting portion further including a support portion, the support portion being a nozzle, the nozzle being used to eject gas for supporting the first substrate when the first cutting portion cuts the first substrate, and the second cutting portion being deactivated with regard to the second substrate when the nozzle is activated.
A cutting device of a liquid crystal panel, the liquid crystal panel comprising a first substrate and a second substrate assembled together, the cutting device of the liquid crystal panel comprising a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate, characterized in that:
- the first cutting portion including a first cutter head for cutting the first substrate, the second cutting portion including a second cutter head for cutting the second substrate, the first cutter head and the second cutter head being staggered in a direction perpendicular to the liquid crystal panel, and the first cutter head and the second cutter head being spaced a distance along a direction parallel to the liquid crystal panel;
- the second cutting portion including a support portion, and the support portion being used to support the first substrate when the first cutting portion cuts the first substrate and the second cutter head of the second cutting portion is deactivated with regard to the second substrate;
- and
- the second cutting portion further including a second base and a second bracket, both the second bracket and the support portion being disposed on the second base, and a distance between the second bracket and the first substrate being less than a distance between the support portion and the first substrate.
Dependencies are inferred from the claim text.