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US 9,067,301 B2Granted
CMP pad dressers with hybridized abrasive surface and related methods
OwnerChien-Min Sunginventor
Life of this patent
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Abstract
A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.
Claims18
A CMP pad conditioner, comprising:
- a plurality of particle abrasive segments, each particle abrasive segment including:
- a particle segment blank;
- and
- an abrasive layer attached to the particle segment blank, the abrasive layer including a plurality of superabrasive particles each having a working end with a tip that aligns along a designated profile and varies from the profile by about 1 micron to about 150 microns;
- and
- a pad conditioner substrate;
- each of the particle abrasive segments being permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layers as the pad conditioner and the CMP pad are moved relative to one another.
4 more elements
Dependencies are inferred from the claim text.