Polishing pad with foundation layer and polishing surface layer
AssigneeNexPlanar Corporation
InventorsWilliam C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
Life of this patent
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Abstract
Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
Claims82
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness less than the first hardness, wherein the polishing surface layer is covalently bonded to the foundation layer.
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness equal to or greater than the first hardness, wherein the polishing surface layer comprises a continuous layer portion with plurality of polishing features protruding there from, the continuous layer portion covalently bonded directly to the foundation layer.
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness less than the first hardness, wherein the polishing surface layer comprises a plurality of discrete polishing protrusions bonded directly to the foundation layer.
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness less than the first hardness, wherein the foundation layer has a surface roughness greater than approximately 1 micrometer Ra (root mean square) where the polishing surface layer is bonded directly to the foundation layer.
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness less than the first hardness, wherein the foundation layer has a smooth surface with a surface roughness less than approximately 1 micrometer Ra (root mean square) where the polishing surface layer is bonded directly to the foundation layer.
A polishing pad for polishing a substrate, the polishing pad comprising:
- a foundation layer having a first hardness;
- and
- a polishing surface layer bonded directly to the foundation layer, the polishing surface layer having a second hardness less than the first hardness, wherein the foundation layer has an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C., wherein the polishing surface layer has an energy loss factor of greater than approximately 1000 KEL at 1/Pa at 40° C., and wherein the foundation layer and the polishing surface layer together have an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C.
Dependencies are inferred from the claim text.