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US 9,065,675 B2Granted
Microstructured adhesive article
Assignee3M Innovative Properties Company
InventorsJayshree Seth, Marie A. Boulos, Janet A. Venne
Life of this patent
Estimating the term…
Abstract
Adhesive articles including transfer tapes and labels are described. The adhesive articles include a low elastic modulus adhesive on a microstructured release liner having a high coefficient of friction release surface. Improvements in die cut quality and razor slit edge quality are shown.
Claims16
An adhesive article comprising a release liner comprising a microstructured release layer, an adhesive having a first major surface in contact with the release layer, and a substrate in contact with a second major surface of the adhesive;
- wherein the release layer has an unstructured coefficient of friction of at least 0.4, wherein the microstructured release layer comprises a microstructure having a depth of at least 5 microns, and wherein the unstructured coefficient of friction is measured according to ASTM D 1894-63, sub-procedure A, wherein the substrate comprises a low surface energy material, wherein the adhesive has an elastic modulus at 20° C. of no greater than 50 kilopascals, wherein the release layer comprises a fluorochemical or a platinum-catalyzed silicone.
Dependencies are inferred from the claim text.