Irregular-surface forming method using plasma-etching process, and electrode member
AssigneeLintec Corporation
InventorsSatoshi Naganawa, Takeshi Kondo
Life of this patent
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Abstract
A method is provided forming a predetermined irregular-surface pattern on a substrate. The method includes carrying out a plasma-etching process using a partly oxidized metal salt film having fine irregular-surface as a resist. In a first step, a metal salt film is formed on the substrate by coating a liquid material containing a metal salt. In a second step, a fine irregular-surface is formed on the metal salt film, and the metal salt film was converted into the resist by the partial oxidization. In a third step, a predetermined irregular-surface is formed on the substrate by carrying out the plasma-etching process to the substrate with the resist.
Claims9
An irregular-surface forming method using a plasma-etching process to form predetermined irregular-surface pattern on a substrate, the substrate being selected from an organic resin film, a resin layer on an organic resin film, and a resin layer on a base, the method comprising:
- (1) forming a metal salt film on the substrate by coating the substrate with a liquid material containing a metal salt;
- (2) forming a fine irregular-surface on the metal salt film having a center line average surface roughness that is set to a value within a range of 2 to 5 nm;
- (3) converting the metal salt film into a resist by partial oxidation;
- and
- (4) plasma-etching the substrate with the resist to form the predetermined irregular-surface pattern on the substrate.
Dependencies are inferred from the claim text.