Systems, methods, and devices for sealing LED light sources in a light module

A light module, comprising:

• a plurality of light emitting diodes (LEDs) coupled to a circuit board;
• at least one lens, each lens disposed over at least one LED of the plurality of LEDs;
• and
• a tape layer disposed between the circuit board and each lens, wherein the tape layer further comprises a top side and a bottom side, the bottom side comprising a first adhesive material and the top side comprising a second adhesive material, and wherein the first adhesive adheres the tape layer to the circuit board.

A light module, comprising:

• a circuit board comprising a top surface;
• a plurality of light emitting diodes (LEDs) coupled to the circuit board;
• at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens comprises a lens cavity;
• one or more air channels formed in or on top of the top surface of the circuit board, at least one of the air channels providing fluid communication between at least one lens cavity and another area of the light module.