# US 9,049,799 B2 · Wiring substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,049,799 B2 - Document ID: US9049799B2 - Status: Granted - Kind: B2 - Application number: 14/021,189 - Filed: 2013-09-09 - Published: 2014-03-27 - Granted: 2015-06-02 - Earliest claimed: 2012-09-27 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Daisuke Takizawa - Web page: https://patentgrep.com/patent/US9049799B2 ## CPC - H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H10W 70/687: {characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage} - H10W 72/00: Interconnections or connectors in packages - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. ## Claims ### Claim 1 A wiring substrate comprising: a core substrate including a first main surface, a second main surface, and a through hole; an electronic component including a resin cover and arranged in the through hole; a projection that projects from an inner wall of the through hole toward the resin cover of the electronic component so that the projection contacts a part of an outer surface of the resin cover while the remainder of the outer surface of the resin cover is spaced from contact with the inner wall of the through hole to form an empty space; an insulator that fills the empty space between the inner wall of the through hole and the electronic component; a first insulation layer that covers the electronic component and the first main surface of the core substrate; a second insulation layer that covers the electronic component and the second main surface of the core substrate; and an engagement groove that is formed in the resin cover of the electronic component and is engaged with the projection, extending along a direction in which the electronic component is fitted into the through hole. ### Claim 2 (depends on 1) The wiring substrate according to claim 1, wherein the projection is one of a plurality of projections including a pair of projections respectively formed on two opposing walls of the through hole, and a distance between tips of the pair of projections formed on the two opposing walls of the through hole is set to be smaller than the dimension of a corresponding portion of the resin cover of the electronic component. ### Claim 3 (depends on 1) The wiring substrate according to claim 1, wherein the resin cover and the insulator are formed from the same thermosetting resin. ### Claim 4 (depends on 1) The wiring substrate according to claim 1, wherein the projection extends continuously from the first main surface to the second main surface on the core substrate. ### Claim 5 (depends on 1) The wiring substrate according to claim 1, wherein the projection includes a tip, and the tip is inclined so that a distance from the resin cover of the electronic component gradually changes from the first main surface toward the second main surface of the core substrate. ### Claim 6 (depends on 1) The wiring substrate according to claim 1, wherein the core substrate includes a reinforcement material. ### Claim 7 (depends on 1) The wiring substrate according to claim 1, wherein the insulator, the first insulation layer, and the second insulation layer are formed from the same thermosetting resin; and the insulator is filled between the electronic component and the inner wall of the through hole when heating and pressurizing the first insulation layer and the second insulation layer. ### Claim 8 (depends on 1) The wiring substrate according to claim 1, wherein the resin cover includes a relatively thicker portion and a relatively thinner portion, and the engagement groove is formed in the relatively thicker portion of the resin cover. ### Claim 9 (depends on 1) The wiring substrate according to claim 1, wherein the electronic component includes a connection terminal covered by the resin cover, the engagement groove continuously extends through the resin cover and the connection terminal. ### Claim 10 A wiring substrate comprising: a core substrate including a through hole and a peaked and elongated projection projecting into the through hole; an electronic component fitted into the through hole from one surface of the core substrate, wherein the electronic component includes a resin cover, a part of an outer surface of the resin cover being engaged with the peaked and elongated projection, and the remainder of the outer surface of the resin cover is spaced from contact with an inner wall of the through hole to form an empty space; and an insulation layer that fills the empty space in the through hole and covers the electronic component, wherein the peaked and elongated projection includes a tip that bites into the resin cover to form an elongated groove that is in close conformance to the tip of the peaked and elongated projection. ### Claim 11 (depends on 10) The wiring substrate according to claim 10, wherein the core substrate includes a plurality of peaked and elongated projections engaged with multiple portions of the resin cover, and two of the plurality of peaked and elongated projections face each other to sandwich the electronic component. ### Claim 12 (depends on 10) The wiring substrate according to claim 10, wherein the electronic component includes an electronic component body and connection terminals arranged at opposite ends of the electronic component body, the resin cover includes a first portion covering the electronic component body and second portions covering the connection terminals, and the core substrate includes a first plurality of peaked and elongated projections each engaged with the first portion of the resin cover, and a second plurality of peaked and elongated projections engaged with the second portions of the resin cover, respectively. ### Claim 13 (depends on 12) The wiring substrate according to claim 12, wherein the through hole includes an oblong opening on a surface of the core substrate, the second plurality of peaked and elongated projections project along a longitudinal axis of the oblong opening of the through hole, and the first plurality of peaked and elongated projections project in a direction orthogonal to the longitudinal axis of the oblong opening of the through hole.