# US 9,049,798 B2 · Multilayered ceramic electronic component and board for mounting the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,049,798 B2 - Document ID: US9049798B2 - Status: Granted - Kind: B2 - Application number: 13/950,657 - Filed: 2013-07-25 - Published: 2014-10-30 - Granted: 2015-06-02 - Earliest claimed: 2013-04-26 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Eung Soo Kim; Dae Bok Oh; Sang Huk Kim; Jae Yeol Choi - Web page: https://patentgrep.com/patent/US9049798B2 ## CPC - H05K 1/181: associated with surface mounted components - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/385: {Single unit multiple capacitors, e.g. dual capacitor in one coil} - H01G 2/06: specially adapted for mounting on a printed-circuit support - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10454: Vertically mounted - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces. ## Claims ### Claim 1 A multilayered ceramic electronic component comprising: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body so as to be alternately exposed through the first and second end surfaces, having the dielectric therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, respectively, include first and second head parts formed on the first and second end surfaces, respectively, and first and second band parts formed on the first and second main surfaces, respectively, and are not formed on the first and second side surfaces. ### Claim 2 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein L/W>1.0 is satisfied. ### Claim 3 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein the first and second internal electrodes are stacked in the thickness direction of the ceramic body. ### Claim 4 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein the first and second internal electrodes are stacked in the width direction of the ceramic body. ### Claim 5 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein when an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6 μm is satisfied. ### Claim 6 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein a thickness of each of the first and second internal electrodes is 0.6 μm or less. ### Claim 7 (depends on 1) The multilayered ceramic electronic component of claim 1, wherein the number of stacked dielectric layers is 500 and more. ### Claim 8 A multilayered ceramic electronic component comprising: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second end surfaces opposing each other in a length direction and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric therebetween; first and second external electrodes electrically connected to the first and second internal electrodes, respectively; and insulation layers formed on the first and second side surfaces, wherein the insulation layers cover regions of the first and second external electrodes formed on the first and second side surfaces. ### Claim 9 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein L/W>1.0 is satisfied. ### Claim 10 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein the first and second internal electrodes are stacked in a thickness direction of the ceramic body. ### Claim 11 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein the first and second internal electrodes are stacked in the width direction of the ceramic body. ### Claim 12 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein when an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6 μm is satisfied. ### Claim 13 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein a thickness of each of the first and second internal electrodes is 0.6 μm or less. ### Claim 14 (depends on 8) The multilayered ceramic electronic component of claim 8, wherein the number of stacked dielectric layers is 500 and more. ### Claim 15 A board for mounting a multilayered ceramic electronic component, the board comprising: a printed circuit board having first and second electrode pads disposed thereon; and a multilayered ceramic electronic component installed on the printed circuit board, wherein the multilayered ceramic electronic component includes: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a width thereof is W, and a thickness thereof is T, and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric layer therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, and wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, respectively, include first and second head parts formed on the first and second end surfaces, respectively, and first and second band parts formed on the first and second main surfaces, respectively, and are not formed on the first and second side surfaces. ### Claim 16 A board for mounting a multilayered ceramic electronic component, the board comprising: a printed circuit board having first and second electrode pads disposed thereon; and a multilayered ceramic electronic component installed on the printed circuit board, wherein the multilayered ceramic electronic component includes: a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a width thereof is W, and a thickness thereof is T, and having first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the first and second end surfaces, having the dielectric therebetween; first and second external electrodes electrically connected to the first and second internal electrodes, respectively; and insulation layers formed on the first and second side surfaces, and the insulation layers cover regions of the first and second external electrodes formed on the first and second side surfaces.