# US 9,049,795 B2 · Rolled copper or copper-alloy foil provided with roughened surface

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- Number: US 9,049,795 B2
- Document ID: US9049795B2
- Status: Granted
- Kind: B2
- Application number: 14/004,794
- Filed: 2012-02-10
- Published: 2014-02-06
- Granted: 2015-06-02
- Earliest claimed: 2011-03-25
- Assignees: JX Nippon Mining & Metals Corporation
- Applicants: Hideta Arai; Atsushi Miki
- Inventors: Hideta Arai; Atsushi Miki
- Web page: https://patentgrep.com/patent/US9049795B2

## CPC

- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- C25D 5/10: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10)
- C25D 5/605: {Surface topography of the layers, e.g. rough, dendritic or nodular layers}
- C25D 5/617: {Crystalline layers}
- C25D 7/0614: {Strips or foils}
- H05K 3/384: {by plating}
- C25D 3/38: of copper
- H05K 2201/0355: Metal foils
- Y10T 428/12076: Next to each other
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Provided is a rolled copper or copper-alloy foil having a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between the copper roughened layer and the rolled copper or copper-alloy foil. An object of the present invention is to provide a roughened rolled copper-alloy foil having fewer craters, the presence of which is a serious disadvantage unique to a rolled copper-alloy foil having a roughened surface. In particular, provided is a rolled copper or copper-alloy foil in which the development of craters caused by inclusions present in or near a surface of the base material can be controlled.

## Claims

### Claim 1

A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between the copper roughened layer and the rolled copper or rolled copper-alloy foil, the copper base plating layer having a thickness of 0.15 to 0.30 μm.

### Claim 2 (depends on 1)

The rolled copper or copper-alloy foil according to claim 1, wherein the copper fine grains of the copper roughened layer are of a size between 0.25 μm and 0.45 μm inclusive.

### Claim 3 (depends on 1)

The rolled copper or copper-alloy foil according to claim 1, wherein a roughened layer comprising Co—Ni—Cu fine grains of between 0.05 μm and 0.25 μm inclusive is provided on the copper roughened layer obtained by roughening treatment with the copper fine grains.

### Claim 4 (depends on 3)

The rolled copper or copper-alloy foil according to claim 3, wherein the Co—Ni—Cu grains have a composition of Cu: 10 to 30 mg/dm2, Ni: 50 to 500 μg/dm2, and Co: 100 to 3,000 μg/dm2.

### Claim 5 (depends on 1)

The rolled copper or copper-alloy foil according to claim 1, wherein the roughened surface has 4.2 craters or less per 25 mm2.

### Claim 6 (depends on 1)

The rolled copper or copper-alloy foil according to claim 1, wherein the roughened surface has 0.5 craters or less per 25 mm2.

### Claim 7

A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between a first copper roughened layer of the copper fine grains and the rolled copper or rolled copper-alloy foil, and wherein a second roughened layer comprising Co—Ni—Cu fine grains of a size of 0.05 to 0.25 μm is further provided on the first copper roughened layer of the copper fine grains.

### Claim 8 (depends on 7)

The rolled copper or copper-alloy foil according to claim 7, wherein the second roughened layer of the Co—Ni—Cu fine grains has a composition of Cu: 10 to 30 mg/dm2, Ni: 50 to 500 μg/dm2, and Co: 100 to 3,000 μg/dm2.

### Claim 9 (depends on 8)

The rolled copper or copper-alloy foil according to claim 8, wherein the copper base plating layer has a thickness of 0.15 to 0.30 μm.

### Claim 10 (depends on 9)

The rolled copper or copper-alloy foil according to claim 9, wherein the copper fine grains of the first copper roughened layer are of a size of 0.25 to 0.45 μm.

### Claim 11 (depends on 10)

The rolled copper or copper-alloy foil according to claim 10, wherein the roughened surface has 4.2 craters or less per 25 mm2.

### Claim 12 (depends on 10)

The rolled copper or copper-alloy foil according to claim 10, wherein the roughened surface has 0.5 craters or less per 25 mm2.

### Claim 13

A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between a copper roughened layer of the copper fine grains and the rolled copper or rolled copper-alloy foil, and the roughened surface having 4.2 craters or less per 25 mm2.

### Claim 14 (depends on 13)

The rolled copper or copper-alloy foil according to claim 13, wherein the roughened surface has 0.5 craters or less per 25 mm2.

### Claim 15 (depends on 13)

The rolled copper or copper-alloy foil according to claim 13, further comprising a second roughened layer provided on the copper roughened layer obtained by roughening treatment with the copper fine grains.

### Claim 16 (depends on 15)

The rolled copper or copper-alloy foil according to claim 15, wherein the second roughened layer comprises Co—Ni—Cu fine grains of a size of 0.05 to 0.25 and a composition of Cu: 10 to 30 mg/dm2, Ni: 50 to 500 μg/dm2, and Co: 100 to 3,000 μg/dm2.

### Claim 17 (depends on 16)

The rolled copper or copper-alloy foil according to claim 16, wherein the roughened surface formed by the first and second roughened layers has 0.5 craters or less per 25 mm2.