# US 9,049,794 B2 · Wiring substrate and method for manufacturing the wiring substrate

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- Number: US 9,049,794 B2
- Document ID: US9049794B2
- Status: Granted
- Kind: B2
- Application number: 13/075,865
- Filed: 2011-03-30
- Published: 2011-12-22
- Granted: 2015-06-02
- Earliest claimed: 2010-06-21
- Assignees: Fujitsu Limited
- Applicants: Yoshihiro Morita; Takahiro Ooi; Tetsuro Yamada; Akiko Matsui; Mitsuhiko Sugane; Takahide Mukoyama
- Inventors: Yoshihiro Morita; Takahiro Ooi; Tetsuro Yamada; Akiko Matsui; Mitsuhiko Sugane; Takahide Mukoyama
- Web page: https://patentgrep.com/patent/US9049794B2

## CPC

- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- D03D 1/0088: {Fabrics having an electronic function}
- D03D 15/267: Glass
- D03D 15/46: Flat yarns, e.g. tapes or films
- H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line}
- D10B 2401/18: including electronic components
- D10B 2505/02: Reinforcing materials; Prepregs
- H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines}
- H05K 1/0248: {Skew reduction or using delay lines}
- H05K 2201/029: Woven fibrous reinforcement or textile
- H05K 2201/091: Locally and permanently deformed areas including dielectric material
- H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
- Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc.
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- D03D: WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D10B: INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

## Claims

### Claim 1

A wiring substrate comprising: an insulation layer including a thermosetting resin and a reinforcement member having a plurality of first fiber bundles and a plurality of second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles; a pair of differential wirings arranged alongside each other on the insulation layer; and
a plurality of holes surrounded by the first fiber bundles and the second fiber bundles;
wherein a part of the plurality of holes is expanded,
wherein a component is inserted into the part of the plurality of holes,
wherein the first fiber bundles and the second fiber bundles have a curved portion relative to a plan view of the insulation layer in a region on which the pair of differential wirings is arranged,
wherein the first fiber bundles and the second fiber bundles are configured to meander relative to the plan view of the insulation layer by the expansion of the part of the plurality of holes,
wherein the pair of differential wirings extend in a direction that is diagonal to the first and second fiber bundles and orthogonal to a direction in which the component is inserted.

### Claim 2 (depends on 1)

The wiring substrate as claimed in claim 1, wherein a pitch between adjacent first fiber bundles and between adjacent second fiber bundles is varied with location in the region.

### Claim 3 (depends on 1)

The wiring substrate as claimed in claim 1, wherein the plurality of holes has different dimension therebetween in the region.

### Claim 4 (depends on 1)

The wiring substrate as claimed in claim 1, wherein the expanded part of the plurality of holes are arranged in grid pattern.

### Claim 5 (depends on 1)

The wiring substrate as claimed in claim 1, wherein the expanded part of the plurality of holes are arranged in staggered pattern.

### Claim 6 (depends on 1)

The wiring substrate as claimed in claim 1, wherein the curved portion of the first and second fiber bundles is periodically arranged in the region relative to the plan view of the insulation layer.