# US 9,049,789 B2 · Mounting adapter, printed board, and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,049,789 B2 - Document ID: US9049789B2 - Status: Granted - Kind: B2 - Application number: 13/845,243 - Filed: 2013-03-18 - Published: 2013-10-03 - Granted: 2015-06-02 - Earliest claimed: 2012-03-28 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Satoshi Ohsawa; Akira Tamura - Web page: https://patentgrep.com/patent/US9049789B2 ## CPC - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 1/0313: {Organic insulating material} - H05K 1/181: associated with surface mounted components - H05K 7/10: Plug-in assemblages of components {, e.g. IC sockets} - H05K 7/1053: {having interior leads} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 2201/10378: Interposers - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract There is provided a mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket. The mounting adapter includes a base having insulating property, a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being to be in contact with an electric pad of the electronic component, a second electrode provided on a second surface of the base, the second electrode facing the socket, the second electrode being to be in contact with a conductor of the socket, and a through via that penetrates through the base and electrically connects the first electrode and the second electrode. ## Claims ### Claim 1 A mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket, the mounting adapter comprising: a base having insulating property; a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being in contact with an electric pad of the electronic component; a second electrode provided on a second surface of the base, the second surface facing the socket, the second electrode being in contact with a conductor of the socket; and a through via that penetrates through the base and electrically connects the first electrode and the second electrode, wherein the conductor comprises a deformable conductive film mounted on an elastic body of the socket. ### Claim 2 (depends on 1) The mounting adapter according to claim 1, wherein the base is made of organic resin. ### Claim 3 (depends on 1) The mounting adapter according to claim 1, wherein an area of the through via is less than an area of the first electrode in plan view. ### Claim 4 (depends on 1) The mounting adapter according to claim 1, wherein the area of the through via is less than an area of the second electrode in plan view. ### Claim 5 (depends on 1) The mounting adapter according to claim 1, wherein the area of the first electrode is less than the area of the second electrode in plan view. ### Claim 6 (depends on 1) The mounting adapter according to claim 1, wherein the first electrode is thicker than the second electrode. ### Claim 7 (depends on 1) The mounting adapter according to claim 1, wherein the base is flexible. ### Claim 8 (depends on 1) The mounting adapter according to claim 1, wherein the base has a portion that is thinner than a portion thereof disposed between the first electrode and the second electrode. ### Claim 9 (depends on 1) The mounting adapter according to claim 1, wherein the first electrode has a thickness greater than a level difference between the pad of the electronic component and a resist material covering the pad. ### Claim 10 (depends on 1) The mounting adapter according to claim 1, wherein the base transmits visible light. ### Claim 11 A printed board comprising: a mounting board; an electronic component that is mounted on the mounting board with a socket interposed therebetween; and a mounting adapter disposed between the socket and the electronic component, the mounting adapter including, a base having insulating property; a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being in contact with an electric pad of the electronic component; a second electrode provided on a second surface of the base, the second surface facing the socket, the second electrode being in contact with a conductor of the socket; and a through via that penetrates through the base and electrically connects the first electrode and the second electrode, wherein the conductor comprises a deformable conductive film mounted on an elastic body of the socket. ### Claim 12 (depends on 11) The printed board according to claim 11, wherein the electronic component is a ball grid array packaged component. ### Claim 13 (depends on 11) The printed board according to claim 11, wherein the electronic component includes a base made of an organic material. ### Claim 14 A method of manufacturing a printed board comprising: attaching a mounting adapter to an electronic component such that a first electrode of the mounting adapter faces an electric pad of the electronic component; the mounting adaptor including, a base having insulating property; the first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being in contact with the electric pad of the electronic component; a second electrode provided on a second surface of the base, the second surface facing a socket, the second electrode being in contact with a conductor of the socket; and a through via that penetrates through the base and electrically connects the first electrode and the second electrode; and mounting the electronic component onto a mounting board with a socket interposed therebetween while bringing the second electrode into contact with a conductor of the socket, wherein the conductor comprises a deformable conductive film mounted on an elastic body of the socket. ### Claim 15 (depends on 14) The method of manufacturing a printed board according to claim 14, wherein the attaching includes performing alignment using an alignment pattern provided on the mounting adapter and an alignment pattern provided on the electronic component.