# US 9,049,780 B2 · Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method

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- Number: US 9,049,780 B2
- Document ID: US9049780B2
- Status: Granted
- Kind: B2
- Application number: 13/353,931
- Filed: 2012-01-19
- Published: 2012-05-17
- Granted: 2015-06-02
- Earliest claimed: 2008-06-20
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Tae-kwon Na
- Inventors: Tae-kwon Na
- Web page: https://patentgrep.com/patent/US9049780B2

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 7/20154: {Heat dissipaters coupled to components}
- H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides}
- H05K 2201/064: Fluid cooling, e.g. by integral pipes
- Y10T 29/49133: with component orienting
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

## Claims

### Claim 1

A method of arranging a plurality of components having a difference between a horizontal length and a vertical length of a circuit board having an air inlet unit and an air outlet unit, the method comprising:
arranging components greater than a predetermined size in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit,
wherein the components having the different horizontal length and vertical length are arranged on the circuit board so that the shorter one of the horizontal length and the vertical length is arranged to face a convectional current direction,
wherein if the components are heat sinks, the heat sinks are arranged in the heat dissipation area so that an edge direction of the heat sinks is identical to a convection current direction, and
wherein respective centers of the plurality of components arranged in the heat dissipation area are located within 1.5 times a dimension of each respective component from the virtual straight line from the air inlet unit to the air outlet unit, the dimension being the shorter one of the horizontal length and the vertical length.

### Claim 2

A circuit apparatus for implementing heat dissipation, the circuit apparatus comprising:
a circuit board on which a plurality of electronic components are mounted;
an air inlet unit;
an air outlet unit; and
the plurality of components arranged on the circuit board,
wherein components greater than a predetermined size are arranged in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit,
wherein components having a difference between a horizontal length and a vertical length are arranged on the circuit board so that the shorter one of the horizontal length and the vertical length is arranged to face a convectional current direction,
wherein if the components are heat sinks, the heat sinks are arranged in the heat dissipation area so that an edge direction of the heat sinks is identical to a convection current direction, and
wherein respective centers of the plurality of components arranged in the heat dissipation area are located within 1.5 times a dimension of each respective component from the virtual straight line from the air inlet unit to the air outlet unit, the dimension being the shorter one of the horizontal length and the vertical length.