# US 9,049,777 B2 · EMI shielded thermoset article

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- Number: US 9,049,777 B2
- Document ID: US9049777B2
- Status: Granted
- Kind: B2
- Application number: 13/285,523
- Filed: 2011-10-31
- Published: 2012-05-03
- Granted: 2015-06-02
- Earliest claimed: 2010-11-01
- Assignees: Plastics Research Corporation
- Applicants: Brian A. Beach; Thomas Atkins
- Inventors: Brian A. Beach; Thomas Atkins
- Web page: https://patentgrep.com/patent/US9049777B2

## CPC

- H05K 9/0047: {being rigid plastic containers having conductive particles, fibres or mesh embedded therein}
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- H05K 9/0083: {comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence)}
- Y10T 428/1355: Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A conductive thermoset material is provided that provides shielding against electromagnetic radiation. The conductive thermoset material includes an intermixed conductive material dispersed essentially throughout. An antisettling additive is present in the conductive thermoset material to support dispersion, optionally, homogenous dispersion of the conductive material in the resin. The conductive thermoset material is formable into one or more articles. The articles may be transportable and resistant to significant conductivity changes by contact with other surfaces.

## Claims

### Claim 1

An article formed with a thermoset electromagnetic interference shielding material said article comprising:
a thermoset resin;
a conductive material comprising a mixture of metallic or metallized spheres and metallic or metallized rods, said conductive material dispersed throughout said thermoset resin;
an antisettling agent added to said thermoset resin, said thermoset resin, said conductive material and said antisettling agent cured in a mold to a shape of the article;
wherein said article is resistant to fracture due to compressive forces that alter the conductive abilities of said article or that allow both ingress and egress of electromagnetic energy; and
wherein said article is a case or wall with said conductive material homogenously dispersed throughout said article shaped into an enclosure to protect an electronic device from electromagnetic interference (EMI).

### Claim 2 (depends on 1)

The article of claim 1 wherein said article is an assembly of a plurality of articles that are conductively interconnected by contact or via a conductive intermediate material.

### Claim 3 (depends on 2)

The article of claim 2 wherein said conductive intermediate material is a different material as the remainder of the article.

### Claim 4 (depends on 1)

The article of claim 1 wherein said article has a surface resistance of 50 ohms/sq or less.

### Claim 5 (depends on 1)

The article of claim 1 wherein said antisettling agent is a rheology additive comprising a urea or a modified urea.

### Claim 6 (depends on 1)

The article of claim 1 wherein said conductive material;
wherein said metallic or metallized spheres are microballoons, plated glass spheres, or hollow microspheres coated with a metal, a conductive polymer, or combinations thereof;
wherein said metal is copper, silver, nickel, aluminum or other metal with a bulk resistivity of 10−5 ohms/cm or less;
wherein said metallic or metallized rods are sintered metal particles, metalized polymer fibers, metalized carbon fibers, or combinations thereof; and
wherein said mixture of metallic or metallized spheres and metallic or metallized rods is homogenously dispersed throughout said thermoset resin.

### Claim 7 (depends on 1)

The article of claim 1 wherein said thermoset electromagnetic interference shielding material has an electromagnetic interference (EMI) shielding effectiveness that ranges between 90 dB at 1 GHz and 68 db at 10 GHz.