# US 9,049,768 B2 · Light emitting diode replacement lamp

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- Number: US 9,049,768 B2
- Document ID: US9049768B2
- Status: Granted
- Kind: B2
- Application number: 14/184,071
- Filed: 2014-02-19
- Published: 2014-08-07
- Granted: 2015-06-02
- Earliest claimed: 2003-09-12
- Assignees: TerraLUX, Inc.
- Applicants: Anthony Catalano; Daniel Harrison; John J. Hall
- Inventors: Anthony Catalano; Daniel Harrison; John J. Hall
- Web page: https://patentgrep.com/patent/US9049768B2

## CPC

- H05B 45/18: using temperature feedback
- F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K 9/233: specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
- F21K 9/238: Arrangement or mounting of circuit elements integrated in the light source
- F21V 23/003: {the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array}
- F21V 23/005: {the substrate is supporting also the light source}
- H05B 45/10: Controlling the intensity of the light
- H05B 45/14: using electrical feedback from LEDs or from LED modules
- H05B 45/3725: Switched mode power supply [SMPS]
- H05B 45/40: Details of LED load circuits
- H05B 45/56: involving measures to prevent abnormal temperature of the LEDs
- F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- H05B 45/3574: Emulating the electrical or functional characteristics of incandescent lamps
- H05B 45/38: using boost topology
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02B 20/30: Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

Thermal management and control techniques for light emitting diode and other incandescent replacement light technologies using a current controller are disclosed.

## Claims

### Claim 1

A method of thermal management of an illumination device comprising a light-emitting diode (LED), the method comprising:
(a) generating a regulated current from a source voltage;
(b) supplying the regulated current to the LED;
(c) generating a sense voltage based on (i) the regulated current and (ii) an LED temperature resulting from heat produced by the LED; and
(d) modifying the regulated current supplied to the LED based on the sense voltage, whereby the LED temperature is maintained within a non-destructive range of LED temperatures.

### Claim 2 (depends on 1)

The method of claim 1, further comprising repeating steps (b)-(d) at least once.

### Claim 3 (depends on 1)

The method of claim 1, wherein generating the sense voltage comprises amplifying at least a portion of the regulated current, an amplitude of the amplification being based on the LED temperature resulting from heat produced by the LED.

### Claim 4 (depends on 1)

The method of claim 1, wherein the LED is disposed on a printed circuit board.

### Claim 5 (depends on 1)

The method of claim 1, further comprising transferring heat away from the LED by at least one of a heat sink or a via in thermal communication with the LED.

### Claim 6 (depends on 1)

The method of claim 1, further comprising dimming the LED.

### Claim 7 (depends on 1)

The method of claim 1, wherein generating the sense voltage comprises flowing at least a portion of the regulated current through a temperature-dependent resistance.

### Claim 8 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance has a positive temperature coefficient.

### Claim 9 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance has a negative temperature coefficient.

### Claim 10 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance comprises a thermistor.

### Claim 11 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance is disposed in contact with the LED.

### Claim 12 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance is spaced away from the LED by a thermal pathway comprising air.

### Claim 13 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance is spaced away from the LED by a thermal pathway comprising a non-air fluid medium.

### Claim 14 (depends on 7)

The method of claim 7, wherein generating the sense voltage comprises flowing a second portion of the regulated current through a resistor connected in parallel to the temperature-dependent resistance.

### Claim 15 (depends on 7)

The method of claim 7, wherein generating the sense voltage comprises flowing a portion of the regulated current through a resistor.

### Claim 16 (depends on 7)

The method of claim 7, wherein the temperature-dependent resistance is (i) disposed on a printed circuit board and (ii) proximate the LED.

### Claim 17 (depends on 7)

The method of claim 7, wherein the LED is disposed on the printed circuit board.

### Claim 18

A thermal-management system for an illumination device comprising a light-emitting diode (LED), the system comprising:
means for generating a regulated current from a source voltage;
means for supplying the regulated current to the LED;
means for generating a sense voltage based on (i) the regulated current and (ii) an LED temperature resulting from heat produced by the LED; and
means for modifying the regulated current supplied to the LED based on the sense voltage, whereby the LED temperature is maintained within a non-destructive range of LED temperatures.

### Claim 19 (depends on 18)

The system of claim 18, further comprising means for amplifying at least a portion of the regulated current.

### Claim 20 (depends on 19)

The system of claim 19, wherein a gain of the amplifying means depends at least in part on the LED temperature resulting from heat produced by the LED.

### Claim 21 (depends on 18)

The system of claim 18, further comprising a printed circuit board on which the LED is disposed.

### Claim 22 (depends on 18)

The system of claim 18, further comprising means for dimming the LED.

### Claim 23 (depends on 18)

The system of claim 18, further comprising means for transferring heat away from the LED.

### Claim 24 (depends on 23)

The system of claim 23, wherein the means for transferring heat away from the LED comprises at least one of a heat sink or a via in thermal communication with the LED.