LED package with encapsulant having planar surfaces

An emitter package, comprising:

• a solid state light source on a submount;
• a encapsulant on said submount, said encapsulant having one or more planar surfaces;
• and
• a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
• a polarity indicator on the bottom surface of said submount.

An emitter package, comprising:

• a solid state light source on a submount;
• an encapsulant on said submount, said encapsulant having one or more planar surfaces,
• a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
• wherein said submount has a footprint area of less than 12 mm square per 1 mm square light source area, wherein said encapsulant is cube shaped.

An emitter package, comprising:

• one or more solid state light sources on a submount;
• and
• an encapsulant on said submount, said encapsulant having one or more planar surfaces,
• a wavelength conversion material layer covering said one or more solid state light sources and the top surface of said submount;
• wherein the ratio of the footprint of said submount to the footprint of said one or more solid state light sources is in the range of just over 1 to approximately 20.

An emitter package, comprising:

• one or more solid state light sources on a submount;
• and
• a transparent encapsulant on said submount, said encapsulant having one or more planar surfaces,
• a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
• wherein said submount has a footprint ratio of approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 5.

A solid state luminaire, comprising:

• a solid state light source with one or more light emitting diode (LED) packages, comprising:
• an LED light source on a submount;
• a blanket conversion material layer on said submount;
• an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source.