Antiballistic article and method of producing same
AssigneeIsrael Military Industries Ltd.
InventorsRon Bergman, Benjamin Yavin
Life of this patent
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Abstract
A light weight pre-stressed antiballistic article including a monolith ceramic plate/tile bonded to a thin lightweight thermal expansion material with an adhesive, characterized, in that the thermal expansion material has a thermal expansion coefficient at least 50% higher than the ceramic plate/tile, and the thermal expansion material is bonded to either the front face, back face or both faces of the ceramic plate/tile at a bonding temperature of between 50° C. and 250° C. with adhesive and subsequently cooled, whereby upon cooling, the bonded thermal expansion material contracts to a greater extent than the ceramic plate/tile, exerting compression stress on the ceramic plate/tile.
Claims7
A method of preparing a lightweight pre-stressed antiballistic monolith ceramic article comprising:
- providing a monolith ceramic plate/tile selected from a group consisting of aluminum oxide (Al2O3), boron carbide (B4C), silicon carbide (SiC), titanium diboride (TiB2), aluminum nitride, silicone nitride, sintered silicone carbide, sintered silicone nitride, and glass-ceramic;
- providing a lightweight high thermal expansion material selected from a metal or metal alloy in the form of a sheet or fabric or grid/net having a thickness of between 0.1 mm and 2.0 mm, and having a thermal expansion coefficient at least 50% greater than that of the ceramic plate/tile;
- providing a bonding adhesive selected from thermosetting or thermoplastic adhesives having a module of elasticity greater than 200 kg/mm2 and a curing temperature of 50° C. to 250° C.;
- bonding the lightweight high thermal expansion material to one or more surfaces of the ceramic plate/tile with the adhesive under bonding conditions selected from the group consisting of (a) bonding under vacuum at a temperature of between 50° C. and 250° C.;
- (b) bonding under vacuum at a temperature of between 50° C. and 250° C. with added external pressure in an autoclave/hydroclave;
- and (c) bonding by a press operation using adequate heated mold, thereby adhering the expanded thermal expansion material to a surface of the ceramic plate/tile;
- and
- allowing the bonded article to cool to ambient temperature, thereby contracting the expanded thermal expansion material on the surface of the ceramic plate/tile producing compression stress in the ceramic plate/tile.
Dependencies are inferred from the claim text.