Thermal management of a communication transceiver in an electrical communication device

A communication device, comprising:

• a chassis defining an interior and an exterior of the communication device, the chassis comprising:
• a top;
• a bottom;
• a plurality of sides that together with the top and the bottom form an enclosure, one of the plurality of sides comprising:
• a first segment disposed in a first plane;
• a second segment disposed in a second plane, the second segment comprising:
• a communication transceiver housing extending outwardly from the second segment and configured to accept installation of a communication transceiver, and
• an aperture in the chassis disposed such that a first portion of a communication transceiver inserted into in the communication transceiver housing extends through the second segment and into the interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device;
• wherein the communication device is configured to maintain a temperature of the communication transceiver housing below a temperature internal to the communication device while the communication device is in operation.