# US 9,041,042 B2 · High density multi-chip LED devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,041,042 B2 - Document ID: US9041042B2 - Status: Granted - Kind: B2 - Application number: 13/017,502 - Filed: 2011-01-31 - Published: 2012-03-22 - Granted: 2015-05-26 - Earliest claimed: 2010-09-20 - Assignees: Cree, Inc. - Applicants: Peter Scott Andrews; Raymond Rosado; Michael P. Laughner; David T. Emerson; Amber C. Abare; Jeffrey C. Britt - Inventors: Peter Scott Andrews; Raymond Rosado; Michael P. Laughner; David T. Emerson; Amber C. Abare; Jeffrey C. Britt - Web page: https://patentgrep.com/patent/US9041042B2 ## CPC - H10W 90/00: Package configurations - H10H 20/8506: {Containers} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/24: comprising multiple light-emitting semiconductor devices - H10H 29/922: {Parallel electrical configurations of multiple light-emitting semiconductor components or devices} - H10H 29/942: {Serial electrical configurations of multiple light-emitting semiconductor components or devices} - Y10T 29/49002: Electrical device making - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. ## Claims ### Claim 1 An LED device comprising: a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal; at least two groups of LED chips fixed to the submount wherein all the LED chips within a group are connected in parallel to one of the at least two semicircular areas of metal; and a plurality of wire bonds, each connected between an LED chip from among the at least two groups of LED chips and the submount, the plurality of wire bonds arranged so that all the wire bonds are disposed on the outside of at least one group of the at least two groups of LED chips and the groups of LED chips are connected in series. ### Claim 2 (depends on 1) The LED device of claim 1 wherein each group comprises six LED chips. ### Claim 3 (depends on 1) The LED device of claim 1 wherein at least one group of LED chips includes LED chips of at least two different sizes. ### Claim 4 (depends on 3) The LED device of claim 3 wherein one size of LED chips is about 1000 microns square and another size of LED chips is about 700 microns or less square. ### Claim 5 (depends on 3) The LED device of claim 3 where one size of LED chips is a vertical LED chip and another size of LED chips is a sideview LED chip. ### Claim 6 (depends on 1) The LED device of claim 1 wherein each group comprises seven LED chips approximately equal in size. ### Claim 7 (depends on 1) The LED device of claim 1 wherein each group comprises eight LED chips. ### Claim 8 (depends on 1) The LED device of claim 1 further comprising an optical element disposed to affect light from the LED chips. ### Claim 9 A method of assembling a high-density LED device, the method comprising: fixing at least two groups of LED chips to a submount, a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal so that all LED chips within a group are connected in parallel to one of the semicircular areas of metal; and connecting a plurality of wire bonds, each between an LED chip from among the at least two groups of LED chips and the submount so that all the wire bonds are disposed on the outside of at least one group of the at least two of LED chips and the groups of LED chips are connected in series. ### Claim 10 (depends on 9) The method of claim 9 further comprising connecting at least some of the wire bonds from each of the two groups of LED chips to a central bus on the base. ### Claim 11 (depends on 10) The method of claim 10 further comprising making the base from alumina. ### Claim 12 (depends on 10) The method of claim 10 further comprising making the base from aluminum nitride. ### Claim 13 (depends on 10) The method of claim 10 wherein at least one group of LED chips includes LED chips of two different sizes. ### Claim 14 (depends on 10) The method of claim 10 further comprising attaching a lens to affect light from the LED chips. ### Claim 15 An LED device comprising: a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal; at least two groups of LED chips fixed to the submount wherein all the LED chips within a group are connected in parallel to one of the at least two semicircular areas of metal, and each of the LED chips within the group has a first terminal connected to the one semicircular area of metal to which the LED chips within the group are fastened; and a plurality of wire bonds, each connected between a second terminal of an LED chip from among the at least two groups of LED chips and the submount, the plurality of wire bonds arranged so that all the wire bonds are disposed on the outside of at least one group of the at least two groups of LED chips and the groups of LED chips are connected in series. ### Claim 16 (depends on 15) The LED device of claim 15 wherein each group comprises six LED chips. ### Claim 17 (depends on 15) The LED device of claim 15 wherein at least one group of LED chips includes LED chips of at least two different sizes. ### Claim 18 (depends on 17) The LED device of claim 17 wherein one size of LED chips is about 1000 microns square and another size of LED chips is about 700 microns or less square. ### Claim 19 (depends on 17) The LED device of claim 17 where one size of LED chips is a vertical LED chip and another size of LED chips is a sideview LED chip. ### Claim 20 (depends on 15) The LED device of claim 15 wherein each group comprises seven LED chips approximately equal in size. ### Claim 21 (depends on 15) The LED device of claim 15 wherein each group comprises eight LED chips.