# US 9,041,037 B2 · Ultraviolet light emitting diode package

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- Number: US 9,041,037 B2
- Document ID: US9041037B2
- Status: Granted
- Kind: B2
- Application number: 14/063,078
- Filed: 2013-10-25
- Published: 2014-03-06
- Granted: 2015-05-26
- Earliest claimed: 2006-09-28
- Assignees: Seoul Viosys Co., Ltd.
- Applicants: Seoul Viosys Co., Ltd.
- Inventors: Jeong Suk Bae; Jae Jo Kim; Do Hyung Kim; Dae Sung Kal
- Web page: https://patentgrep.com/patent/US9041037B2

## CPC

- H10H 20/856: Reflecting means
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/8582: {characterised by their shape}
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip.

## Claims

### Claim 1

An ultraviolet light emitting diode (UV LED) assembly, comprising:
a lamp body comprising a base portion;
a first lead pin passing through the base portion;
an LED chip arranged on the base portion;
a silicon molding member disposed on the LED chip;
a reflective fence portion arranged on the base portion; and
wherein:
the base portion of the lamp body comprises an insulating material through which the first lead pin passes; and
an entire region of the base portion extending between the fence portion comprises the insulating material.

### Claim 2 (depends on 1)

The UV LED assembly of claim 1, wherein the lamp body further comprises a stepped portion surrounding the LED chip on the base portion.

### Claim 3 (depends on 1)

The UV LED assembly of claim 1, wherein the silicon molding member is disposed on a substantially flat portion of the lamp body.

### Claim 4 (depends on 1)

The UV LED assembly of claim 1, wherein the silicon molding member comprises a convex light emitting surface.

### Claim 5 (depends on 1)

The UV LED assembly of claim 1, wherein the silicon molding member comprises a concave or substantially flat light emitting surface.

### Claim 6 (depends on 1)

The UV LED assembly of claim 1, further comprising a phosphor disposed in the silicon molding member.

### Claim 7 (depends on 1)

The UV LED assembly of claim 1, further comprising an insulating adhesive arranged between the base portion of the lamp body and the first lead pin, the insulating adhesive to electrically insulate the base portion of the lamp body and the first lead pin from each other.