# US 9,041,024 B2 · Method and system for forming LED light emitters > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,041,024 B2 - Document ID: US9041024B2 - Status: Granted - Kind: B2 - Application number: 14/539,863 - Filed: 2014-11-12 - Published: 2015-03-12 - Granted: 2015-05-26 - Earliest claimed: 0212-03-02 - Assignees: LedEngin, Inc. - Applicants: LedEngin, Inc. - Inventors: Xiantao Yan - Web page: https://patentgrep.com/patent/US9041024B2 ## CPC - F21V 5/007: {Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008)} - F21K 9/90: Methods of manufacture - F21V 5/04: of lens shape - F21V 9/32: characterised by the arrangement of the photoluminescent material - F21V 9/38: Combination of two or more photoluminescent elements of different materials - F21V 19/003: {Fastening of light source holders, e.g. of circuit boards or substrates holding light sources} - F21V 21/14: Adjustable mountings - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/0278: {Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material} - H05K 1/0283: {Stretchable printed circuits} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)} - H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)} - H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies - H10H 20/85: Packages - H10H 20/8585: {being an interconnection} - H10W 90/00: Package configurations - F21Y 2115/10: Light-emitting diodes [LED] - H05K 3/4626: {characterised by the insulating layers or materials (H05K3/4688 takes precedence)} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/0909: Preformed cutting or breaking line - H05K 2201/09127: PCB or component having an integral separable or breakable part - H05K 2201/09263: Meander - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2203/0143: Using a roller; Specific shape thereof; Providing locally adhesive portions thereon - H05K 2203/171: Tuning, e.g. by trimming of printed components or high frequency circuits - H10H 20/855: Optical field-shaping means, e.g. lenses - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has a ceramic substrate sheet overlying the support substrate, and the ceramic substrate sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the ceramic substrate sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses. ## Claims ### Claim 1 A flexible sheet of light-emitting diode (LED) light emitters, comprising: a support substrate including a thermally conductive material; a ceramic substrate sheet overlying support substrate, the ceramic substrate sheet including a plurality of LED light emitters; a flexible circuit sheet overlying the ceramic substrate sheet; a phosphor sheet overlying flexible circuit sheet, the phosphor sheet including a wave-length converting material; and a lens sheet overlying the phosphor sheet, the lens sheet including a plurality of lenses. ### Claim 2 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein the flexible sheet of LED emitters is also stretchable. ### Claim 3 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein each of the plurality of lenses in the lens sheet is aligned to a corresponding one of the plurality of LED light emitters. ### Claim 4 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein the lens sheet comprises pre-formed notches between adjacent lenses. ### Claim 5 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein the ceramic substrate comprises pre-formed notches between adjacent emitters. ### Claim 6 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein the lens sheet comprises separate lenses. ### Claim 7 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein the ceramic substrate comprises separate LED emitters. ### Claim 8 (depends on 1) The flexible sheet of LED light emitters of claim 1, wherein a plurality of LED light emitters are inorganic solid-state based LED light sources. ### Claim 9 A flexible sheet of light-emitting diode (LED) light emitters, comprising a stack of sheets including a lens sheet, a phosphor sheet, a flexible circuit sheet, a ceramic substrate sheet, and a support substrate, wherein: the support substrate includes a thermally conductive material; the ceramic substrate sheet includes a plurality of LED light emitters; the flexible circuit sheet includes conductive wires; the phosphor sheet includes a wave-length converting material; and the lens sheet includes a plurality of micro lenses. ### Claim 10 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein each of the plurality of lenses in the lens sheet is aligned to a corresponding one of the plurality of LED light emitters. ### Claim 11 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the lens sheet comprises pre-formed notches between adjacent lenses. ### Claim 12 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the ceramic substrate comprises pre-formed notches between adjacent emitters. ### Claim 13 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the flexible sheet of LED light emitters is also stretchable. ### Claim 14 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the flexible circuit sheet is also stretchable and the conductive wires are in zig-zag form. ### Claim 15 (depends on 14) The flexible sheet of LED light emitters of claim 14, wherein the flexible circuit sheet comprises conductive wires that are in zig-zag form. ### Claim 16 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein a plurality of LED light emitters are inorganic solid-state based LED light sources. ### Claim 17 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the flexible circuit sheet is disposed under the plurality of LED light emitters. ### Claim 18 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the flexible circuit sheet is disposed over the plurality of LED light emitters. ### Claim 19 (depends on 9) The flexible sheet of LED light emitters of claim 9, wherein the flexible circuit sheet is disposed under the plurality of LED light emitters, and a second flexible circuit sheet is disposed over the plurality of LED light emitters.