# US 9,041,022 B2 · Light emitting diode package and method for manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,041,022 B2
- Document ID: US9041022B2
- Status: Granted
- Kind: B2
- Application number: 14/011,682
- Filed: 2013-08-27
- Published: 2014-03-27
- Granted: 2015-05-26
- Earliest claimed: 2012-09-21
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Advanced Optoelectronic Technology, Inc.
- Inventors: Che-Hsang Huang; Pin-Chuan Chen; Lung-Hsin Chen; Wen-Liang Tseng; Yu-Liang Huang
- Web page: https://patentgrep.com/patent/US9041022B2

## CPC

- H10H 20/83: Electrodes
- H10W 72/0198: {batch processes}
- H10W 90/00: Package configurations
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

## Claims

### Claim 1

A light emitting diode (LED) package comprising:
an electrically insulating substrate;
an electrode structure embedded in the insulating substrate, the electrode structure comprising a first electrode, a second electrode and a third electrode spaced from each other; and
a plurality of LED chips electrically connecting with the electrode structure, the third electrode being located between the first and second electrodes, top surfaces of the first, second and third electrodes being exposed out of a top surface of the insulating substrate to support the LED chips, front side faces of the first and second electrodes being exposed out of the front side face of the substrate, circumferential side faces of the third electrode being encapsulated in the substrate.

### Claim 2 (depends on 1)

The LED package of claim 1, wherein rear side faces of the first and second electrodes are also exposed out of the corresponding rear side face of the substrate.

### Claim 3 (depends on 2)

The LED package of claim 2, wherein bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the substrate, and bottom surface of the third electrode is encapsulated in the substrate.

### Claim 4 (depends on 3)

The LED package of claim 3, wherein top surfaces of the first, second and third electrodes are coplanar with the top surface of the substrate, and bottom surfaces of the first and second electrodes are coplanar with the bottom surface of the substrate.

### Claim 5 (depends on 1)

The LED package of claim 1, wherein the LED chips comprises a first LED chip and a second LED chip, the first LED chip electrically connects the first and third electrode respectively, and the second LED chip electrically connects the second and the third electrodes respectively.

### Claim 6 (depends on 1)

The LED package of claim 1, wherein the electrode structure further comprises a fourth electrode located between the third and second electrodes, the fourth electrode connects with the third electrode via a connecting bar.

### Claim 7 (depends on 6)

The LED package of claim 6, wherein top surface of the fourth electrode are exposed out of the top surface of the substrate to support LED chips, circumferential side faces of the fourth electrode are encapsulated in the substrate.

### Claim 8 (depends on 7)

The LED package of claim 7, wherein bottom surfaces of the third and fourth electrodes are encapsulated in the substrate.

### Claim 9 (depends on 8)

The LED package of claim 8, wherein top surfaces of the first, second, third and fourth electrodes are coplanar with the top surface of the substrate.

### Claim 10 (depends on 7)

The LED package of claim 7, wherein the LED chips comprises a first LED chip and a second LED chip, the first LED chip is mounted on the top surface of the third electrode, and electrically connects the first and third electrodes respectively, the second LED chip is mounted on the top surface of the second electrode, and electrically connects the second and fourth electrodes respectively.

### Claim 11 (depends on 5)

The LED package of claim 5, wherein a reflector is located on the substrate, the reflector defines a first through hole and a second through hole spaced from the first through hole, the first LED chips is located at the bottom of the first through hole, and the second LED chips is located at the bottom of the second through hole.

### Claim 12 (depends on 10)

The LED package of claim 10, wherein a reflector is located on the substrate, the reflector defines a first through hole and a second through hole spaced from the first through hole, the first LED chips is located at the bottom of the first through hole, and the second LED chips is located at the bottom of the second through hole.