# US 9,041,019 B2 · Method of and device for manufacturing LED assembly using liquid molding technologies

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- Number: US 9,041,019 B2
- Document ID: US9041019B2
- Status: Granted
- Kind: B2
- Application number: 13/660,893
- Filed: 2012-10-25
- Published: 2014-05-01
- Granted: 2015-05-26
- Earliest claimed: 2012-10-25
- Assignees: Flextronics AP, LLC
- Applicants: Flextronics AP, LLC
- Inventors: Samuel Tam; Murad Kurwa; Dick Pang
- Web page: https://patentgrep.com/patent/US9041019B2

## CPC

- H10H 20/01: Manufacture or treatment
- H10H 20/852: Encapsulations
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/851: Wavelength conversion means
- H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/075: {of bond wires}
- H10W 72/30: Die-attach connectors
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/00: Package configurations
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation.

## Claims

### Claim 1

A method of making a LED assembly comprising:
a. forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, wherein the liquid transfer mold comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the mold complimentary to the dam structures to concurrently form the multiple dam structures;
b. coupling multiple LED dies on the silicon wafer within each of the dam structures;
c. adding phosphor to an area enclosed by the multiple dam structures;
d. curing the phosphor; and
e. encapsulating the phosphor.

### Claim 2 (depends on 1)

The method of claim 1, further comprising using a liquid molding mold.

### Claim 3 (depends on 1)

The method of claim 1, wherein the forming multiple dam structures comprises using a liquid molding mold.

### Claim 4 (depends on 1)

The method of claim 1, wherein the encapsulating the phosphor comprises using a liquid molding mold.

### Claim 5 (depends on 1)

The method of claim 1, wherein the encapsulating the phosphor comprises forming one or more dome structures on the multiple dam structures.

### Claim 6 (depends on 1)

The method of claim 1, further comprising singulating after the encapsulating the phosphor.

### Claim 7 (depends on 1)

The method of claim 1, further comprising concurrently forming the multiple dam structures on the silicon wafer.

### Claim 8 (depends on 1)

The method of claim 1, further comprising concurrently forming multiple dome structures on the silicon wafer.

### Claim 9 (depends on 1)

The method of claim 1, further comprising cutting the silicon wafer into one or more strips after the forming multiple dam structures.

### Claim 10

A method of making LED comprising:
a. concurrently forming an array of plural dam structures on a silicon wafer using a liquid transfer mold, wherein the liquid transfer mold comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the liquid transfer mold complimentary to the dam structures to concurrently form the multiple dam structures;
b. coupling one or more of LED dies to the plurality of the dam structures;
c. coupling wires to the LED dies;
d. adding phosphor to be contained within the dam structure; and
e. forming a dome structure on each of the dam structure using a liquid transfer mold.

### Claim 11 (depends on 10)

The method of claim 10, further comprising singulating.

### Claim 12 (depends on 11)

The method of claim 11, wherein the singulating is performed by a saw.

### Claim 13 (depends on 10)

The method of claim 10, further comprising forming an array of multiple LED light units on the silicon wafer.

### Claim 14 (depends on 10)

The method of claim 10, wherein the wires comprise gold wires.

### Claim 15

A method of making LED comprising:
a. concurrently forming multiple dam structures on a whole silicon wafer using a first liquid molding, wherein the first liquid molding comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the first liquid molding complimentary to the dam structures to concurrently form the multiple dam structures;
b. attaching at least one die to each of the multiple dam structure;
c. performing flux reflow;
d. performing flux cleaning;
e. performing wire bonding;
f. dispensing phosphor after wire bonding;
g. curing the dispensed phosphor;
h. concurrently forming a dome structure on each of the multiple dam structures using a second liquid molding;
i. mounting the whole silicon wafer; and
j. sigulating by a saw.