# US 9,040,884 B2 · Apparatus for fabricating semiconductor devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,884 B2 - Document ID: US9040884B2 - Status: Granted - Kind: B2 - Application number: 13/412,674 - Filed: 2012-03-06 - Published: 2012-11-29 - Granted: 2015-05-26 - Earliest claimed: 2011-05-24 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Il-Young Han; Jae-Sung Kwon; Sang-Wook Park; Won-Keun Kim - Inventors: Il-Young Han; Jae-Sung Kwon; Sang-Wook Park; Won-Keun Kim - Web page: https://patentgrep.com/patent/US9040884B2 ## CPC - H10P 72/0436: {mainly by radiation} - H05B 6/80: Apparatus for specific applications (stoves or ranges F24C7/02) - H10P 72/0458: {vertical arrangement} - H10P 72/0462: {characterised by the construction of the processing chambers, e.g. modular processing chambers} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract An apparatus for fabricating semiconductor devices includes a chamber having a bottom plane, a side wall and a lid. An irradiating unit is at an interior of the chamber. A substrate mounting unit is between the bottom plane of the chamber and the irradiating unit. The irradiating unit includes an irradiating tube and a hole penetrating the central region of the irradiating tube. The irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is opened to the substrate mounting unit. ## Claims ### Claim 1 An apparatus for fabricating semiconductor devices comprising: a chamber having a bottom plane, a side wall and a lid; an irradiating unit at an interior of the chamber; and a substrate mounting unit between the bottom plane of the chamber, and the irradiating unit, wherein the irradiating unit comprises an irradiating tube and a hole penetrating a central region of the irradiating tube, the irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is open to the substrate mounting unit. ### Claim 2 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, wherein the bottom plane is in a shape of an asymmetric polygon, and the side wall includes a plurality of surfaces corresponding respectively to a plurality of sides of the asymmetric polygon. ### Claim 3 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, wherein the irradiating tube comprises a partition separating an inner space of the irradiating tube. ### Claim 4 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, further comprising a supply unit exterior to the chamber, wherein the supply unit comprises a first wave guiding tube, an absorbing tube and a microwave machine, the first wave guiding tube has one end communicating with the irradiating unit and the other end extending from the side wall of the chamber to a position exterior to the chamber. ### Claim 5 (depends on 4) The apparatus for fabricating semiconductor devices of claim 4, wherein the other end of the first wave guiding tube comprises a first passageway connected to the absorbing tube, and a second passageway connected to the microwave machine. ### Claim 6 (depends on 4) The apparatus for fabricating semiconductor devices of claim 4, wherein the irradiating unit comprises a second wave guiding tube communicating with the supply unit through the side wall of the chamber. ### Claim 7 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, further comprising an absorbing unit at a position exterior to the chamber, wherein the absorbing unit communicates with the interior of the chamber through the side wall of the chamber. ### Claim 8 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, wherein the irradiating unit further comprises an irradiation guiding member, the irradiation guiding member comprises a plurality of slits, and the lower surface of the irradiating tube is covered with the irradiation guiding member. ### Claim 9 (depends on 8) The apparatus for fabricating semiconductor devices of claim 8, wherein the plurality of slits are formed as at least one of concentric circles and in a spiral shape. ### Claim 10 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, wherein the substrate mounting unit comprises a process chuck having a central region and a peripheral region, and the central region and the peripheral region have a step difference with respect to each other. ### Claim 11 (depends on 10) The apparatus for fabricating semiconductor devices of claim 10, wherein the process chuck comprises metal. ### Claim 12 (depends on 10) The apparatus for fabricating semiconductor devices of claim 10, further comprising a rotation unit under the substrate mounting unit, wherein the rotation unit revolves and rotates the process chuck. ### Claim 13 (depends on 1) The apparatus for fabricating semiconductor devices of claim 1, further comprising a heat sensing part on the lid of the chamber. ### Claim 14 (depends on 13) The apparatus for fabricating semiconductor devices of claim 13, further comprising a protection tube aligned with the heat sensing part under the lid of the chamber, wherein the protection tube penetrates the irradiating tube through the hole of the irradiating tube, and the heat sensing part faces the substrate mounting unit through the protection tube. ### Claim 15 An apparatus for fabricating semiconductor devices comprising: a chamber comprising a bottom plane and a lid shaped as an asymmetric polygon, and a side wall having a same number of surfaces as sides of the polygon; an irradiating unit at a central region of an interior of the chamber; a process chuck between the bottom plane of the chamber, and the irradiating unit, wherein the irradiating unit comprises a hollow ring on the process chuck, one end of the irradiating unit is closed, and the other end of the irradiating unit is fixed to the side wall of the chamber. ### Claim 16 An apparatus for fabricating semiconductor devices comprising: a partially enclosed chamber; an irradiating unit at an interior of the chamber having a hollow disk shape; a substrate mounting unit between a bottom of the chamber, and the irradiating unit; and a rotation unit, a portion of the rotation unit being between the substrate mounting unit and the bottom of the chamber, wherein the rotation unit revolves and rotates the substrate mounting unit. ### Claim 17 (depends on 16) The apparatus for fabricating semiconductor devices of claim 16, wherein the chamber further comprises a bottom plane, a side wall and a lid, and wherein the bottom plane is in a shape of an asymmetric polygon, and the side wall includes a plurality of surfaces corresponding respectively to a plurality of sides of the asymmetric polygon. ### Claim 18 (depends on 16) The apparatus for fabricating semiconductor devices of claim 16, further comprising a heat sensing part on a lid of the chamber. ### Claim 19 (depends on 18) The apparatus for fabricating semiconductor devices of claim 18, further comprising a protection tube aligned with the heat sensing part under the lid of the chamber, wherein the irradiating unit comprises an irradiating tube and a hole penetrating a central region of the irradiating tube wherein the protection tube penetrates the irradiating tube through the hole of the irradiating tube, and the heat sensing part faces the substrate mounting unit through the protection tube. ### Claim 20 (depends on 16) The apparatus for fabricating semiconductor devices of claim 16, wherein the irradiating unit further comprises an irradiating tube and an irradiation guiding member, the irradiation guiding member comprises a plurality of slits, and the lower surface of the irradiating tube is covered with the irradiation guiding member.