# US 9,040,842 B2 · Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

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- Number: US 9,040,842 B2
- Document ID: US9040842B2
- Status: Granted
- Kind: B2
- Application number: 13/867,851
- Filed: 2013-04-22
- Published: 2013-11-14
- Granted: 2015-05-26
- Earliest claimed: 2008-03-31
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Ravi Nalla; Omar Bchir; Houssam Jomaa
- Web page: https://patentgrep.com/patent/US9040842B2

## CPC

- H10W 20/425: {Barrier, adhesion or liner layers}
- C08J 5/18: Manufacture of films or sheets
- H05K 1/0298: {Multilayer circuits}
- H05K 3/381: {by special treatment of the substrate}
- H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)}
- H10W 72/30: Die-attach connectors
- C08J 2363/00: Characterised by the use of epoxy resins; Derivatives of epoxy resins
- H05K 3/181: {by electroless plating (adhesives therefor H05K3/387)}
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0212: Resin particles
- H05K 2203/0773: Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
- H05K 2203/0796: Oxidant in aqueous solution, e.g. permanganate
- Y10T 156/1052: with cutting, punching, tearing or severing
- Y10T 428/249921: Web or sheet containing structurally defined element or component
- Y10T 428/254: Polymeric or resinous material
- Y10T 428/268: Monolayer with structurally defined element
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

## Claims

### Claim 1

An apparatus comprising:
a substrate build-up film, wherein the build-up film comprises:
an epoxy material; and
a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured and an exterior formed from the same material as the interior, is more cured than the interior.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the build-up film further comprises silica filler.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the epoxy microspheres comprise a concentration of from about 3 to about 5 volume percent.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the microspheres have a diameter of from about 1 to about 2 micrometers.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the interior of the microspheres is uncured.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein the interior of the microspheres is partially cured.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein an exterior of the microspheres is fully cured.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein an exterior of the microspheres is partially cured.

### Claim 9 (depends on 1)

The apparatus of claim 1, further comprising a metallization layer coupled with the build-up film.

### Claim 10

An IC package, comprising:
a substrate build-up film, wherein the build-up film comprises:
an epoxy material;
a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured and an exterior formed from the same material as the interior, is more cured than the interior;
an opening in the substrate build up film; and
a metallic layer formed over exposed surfaces in the opening.

### Claim 11 (depends on 10)

The IC package of claim 10, wherein the metallic layer includes copper.

### Claim 12 (depends on 10)

The IC package of claim 10, further including a metallization layer located adjacent to the substrate build-up film, wherein the metallic layer electrically couples to the metallization layer.