# US 9,040,840 B2 · Multilayer ceramic electronic component and mounting board therefor

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- Number: US 9,040,840 B2
- Document ID: US9040840B2
- Status: Granted
- Kind: B2
- Application number: 13/968,614
- Filed: 2013-08-16
- Published: 2014-11-06
- Granted: 2015-05-26
- Earliest claimed: 2013-05-06
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Eun Sun Chung; Dae Bok Oh; Jae Man Park; Seung Ho Lee
- Web page: https://patentgrep.com/patent/US9040840B2

## CPC

- H01G 4/018: Dielectrics
- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 4/01: Form of self-supporting electrodes
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H05K 1/181: associated with surface mounted components
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

There is provided a multilayer ceramic electronic component comprising a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface thereof is defined as W, and a thickness thereof is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers therebetween, wherein the ceramic body includes an active layer and cover layers and in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region, are defined as ta and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.

## Claims

### Claim 1

A multilayer ceramic electronic component, comprising:
a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T; and
first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween,
wherein the ceramic body includes an active layer, corresponding to a capacitance formation part contributing to capacitance formation, and cover layers, corresponding to non-capacitance formation parts, provided on at least one of upper and lower surfaces of the active layer, and
in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region among the three regions, are defined as ta and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.

### Claim 2 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein when an average thickness of the dielectric layers is defined as td, 0.1 μm≦td≦0.6 μm is satisfied.

### Claim 3 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein when an average thickness of the first and second internal electrodes is defined as te, 0.2 μm≦te≦0.85 μm is satisfied.

### Claim 4 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein widths of the internal electrodes in the lower region are larger than those of the internal electrodes in the upper region.

### Claim 5 (depends on 1)

The multilayer ceramic electronic component of claim 1, wherein a difference between connectivity of the internal electrodes in the lower region and connectivity of the internal electrodes in the upper region is 5% or more.

### Claim 6

A multilayer ceramic electronic component comprising:
a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T; and
first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween,
wherein a cross-section of the ceramic body in a width-thickness direction (W-T) has a trapezoidal shape.

### Claim 7 (depends on 6)

The multilayer ceramic electronic component of claim 6, wherein the ceramic body includes an active layer, corresponding to a capacitance formation part contributing to capacitance formation, and cover layers, corresponding to non-capacitance formation parts, provided on at least one of upper and lower surfaces of the active layer, and
in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region among the three regions, are defined as ta and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.

### Claim 8 (depends on 7)

The multilayer ceramic electronic component of claim 7, wherein widths of the internal electrodes in the lower region are larger than those of the internal electrodes in the upper region.

### Claim 9 (depends on 7)

The multilayer ceramic electronic component of claim 7, wherein a difference between connectivity of the internal electrodes in the lower region and connectivity of the internal electrodes in the upper region is 5% or more.

### Claim 10 (depends on 6)

The multilayer ceramic electronic component of claim 6, wherein when an average thickness of the first and second internal electrodes is defined as te, 0.2 μm≦te≦0.85 μm is satisfied.

### Claim 11

A mounting board for a multilayer ceramic electronic component, the mounting board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
a multilayer ceramic electronic component mounted on the printed circuit board,
wherein the multilayer ceramic electronic component includes: a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T; and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween,
the ceramic body includes an active layer, corresponding to a capacitance formation part contributing to capacitance formation, and cover layers, corresponding to non-capacitance formation parts, provided on at least one of upper and lower surfaces of the active layer, and
in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region among the three regions, are defined as ta and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.

### Claim 12 (depends on 11)

The mounting board of claim 11, wherein when an average thickness of the dielectric layers is defined as td, 0.1 μm≦td≦0.6 μm is satisfied.

### Claim 13 (depends on 11)

The mounting board of claim 11, wherein when an average thickness of the first and second internal electrodes is defined as te, 0.2 μm≦te≦0.85 μm is satisfied.

### Claim 14 (depends on 11)

The mounting board of claim 11, wherein widths of the internal electrodes in the lower region are larger than those of the internal electrodes in the upper region.

### Claim 15 (depends on 11)

The mounting board of claim 11, wherein a difference between connectivity of the internal electrodes in the lower region and connectivity of the internal electrodes in the upper region is 5% or more.