# US 9,040,837 B2 · Wiring board and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,837 B2 - Document ID: US9040837B2 - Status: Granted - Kind: B2 - Application number: 13/665,550 - Filed: 2012-10-31 - Published: 2013-06-20 - Granted: 2015-05-26 - Earliest claimed: 2011-12-14 - Assignees: Ibiden Co., Ltd. - Applicants: Michimasa Takahashi; Teruyuki Ishihara - Inventors: Michimasa Takahashi; Teruyuki Ishihara - Web page: https://patentgrep.com/patent/US9040837B2 ## CPC - H05K 1/0298: {Multilayer circuits} - H05K 1/0278: {Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H05K 3/46: Manufacturing multilayer circuits - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - Y10T 29/49126: Assembling bases - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 156/10: Methods of surface bonding and/or assembly therefor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer. ## Claims ### Claim 1 A wiring board, comprising: a first multilayer wiring board comprising a plurality of first conductive layers and having a surface; a second multilayer wiring board having a plurality of second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board; and an adhesive layer comprising an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board, wherein the first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer, the adhesive layer has a penetrating hole connecting the first pad and the second pad and having a hole diameter which is set greater than the first pad and the second pad such that the penetrating hole has a clearance between the first pad and the penetrating hole and a clearance between the second pad and the penetrating hole, the clearance between the penetrating hole and the first pad is filled with resin, and the clearance between the penetrating hole and the second pad is filled with resin. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein the plurality of first conductive layers of the first multilayer wiring board includes a first conductive layer formed on the surface of the first multilayer wiring board and including the first pad, the plurality of second conductive layers of the second multilayer wiring board includes a second conductive layer formed on the surface of the second multilayer wiring board and including the second pad, and the first conductive layer and the second conductive layer comprise wirings which do not face each other, excluding the first pad and the second pad. ### Claim 3 (depends on 1) The wiring board according to claim 1, wherein the plurality of first conductive layers of the first multilayer wiring board includes a first conductive layer formed on the surface of the first multilayer wiring board, the first conductive layer has a plurality of wiring portions and includes the first pad, the plurality of second conductive layers of the second multilayer wiring board includes a second conductive layer formed on the surface of the second multilayer wiring board and consisting of the second pad, and the first pad is set to have a smaller area than the second pad. ### Claim 4 (depends on 1) The wiring board according to claim 1, wherein the plurality of first conductive layers of the first multilayer wiring board includes a first conductive layer formed on the surface of the first multilayer wiring board, the first conductive layer has a plurality of wiring portions and includes the first pad, the plurality of second conductive layers of the second multilayer wiring board includes a second conductive layer formed on the surface of the second multilayer wiring board and consisting of the second pad, and the first pad is set to have a greater area than the second pad. ### Claim 5 (depends on 1) The wiring board according to claim 1, wherein at least one of the first multilayer wiring board and the second multilayer wiring board includes a plurality of filled via conductors comprising plated materials connecting at least one of the plurality of first conductive layers and the plurality of second conductive layers, respectively. ### Claim 6 (depends on 5) The wiring board according to claim 5, wherein at least one of the first pad and the second pad is positioned such that one of the filled via conductors is in contact with at least one of the first pad and the second pad. ### Claim 7 (depends on 6) The wiring board according to claim 6, wherein the filled via conductors are formed in truncated cone shapes tapering in a lamination direction of the at least one of the first multilayer wiring board and the second multilayer wiring board, and the at least one of the first pad and the second pad is formed to make contact with a surface of the one of the filled via conductors in contact such that the surface of the one of the filled via conductors in contact is a surface having a larger diameter of a truncated cone shape. ### Claim 8 (depends on 1) The wiring board according to claim 1, wherein at least one of the first multilayer wiring board and the second multilayer wiring board includes a plurality of via conductors connecting at least one of the plurality of first conductive layers and the plurality of second conductive layers, and the plurality of via conductors reverses a tapering direction more than twice. ### Claim 9 (depends on 1) The wiring board according to claim 1, wherein at least one of the first pad and the second pad has a tin-plated layer formed on a surface of the at least one of the first pad and the second pad. ### Claim 10 (depends on 1) The wiring board according to claim 1, wherein the second multilayer wiring board and the adhesive layer have substantially a same size. ### Claim 11 (depends on 1) The wiring board according to claim 1, wherein the first multilayer wiring board comprises a first core substrate and a plurality of first insulation layers laminated on the first core substrate, the second multilayer wiring board comprises a second core substrate and a plurality of second insulation layers laminated on the second core substrate, and the first insulation layers, the second insulation layers and the adhesive sheet of the adhesive layer are made of a same material. ### Claim 12 (depends on 1) The wiring board according to claim 1, further comprising: a third multilayer wiring board comprising a plurality of third conductive layers and positioned such that the third multilayer wiring board has a surface facing a second surface of the first multilayer wiring board; and a second adhesive layer comprising an adhesive sheet and interposed between the first multilayer wiring board and the third multilayer wiring board such that the second adhesive layer is adhering the first multilayer wiring board and the third multilayer wiring board, wherein the third multilayer wiring board has a third pad formed on the surface of the third multilayer wiring board such that the third pad faces a pad on the second surface of the first multilayer wiring board across the second adhesive layer interposed between the first multilayer wiring board and the third multilayer wiring board. ### Claim 13 (depends on 12) The wiring board according to claim 12, wherein the plurality of second conductive layers in the second multilayer wiring board and the plurality of third conductive layers in the third multilayer wiring board have different numbers of conductive layers. ### Claim 14 (depends on 1) The wiring board according to claim 1, wherein the first multilayer wiring board is a rigid wiring board, and the second multilayer wiring board is a rigid wiring board. ### Claim 15 (depends on 1) The wiring board according to claim 1, wherein the first multilayer wiring board is a flex-rigid wiring board comprising a plurality of rigid wiring boards and a flexible wiring board connecting the rigid wiring boards. ### Claim 16 (depends on 1) The wiring board according to claim 1, wherein the first multilayer wiring board has a built-in metal sheet formed in the first multilayer wiring board. ### Claim 17 (depends on 1) The wiring board according to claim 1, wherein the resin filling the clearance between the penetrating hole and the clearance between the penetrating hole and the second pad is derived from the adhesive layer. ### Claim 18 (depends on 1) The wiring board according to claim 1, further comprising a bonding layer connecting the first pad and the second pad in the penetrating hole. ### Claim 19 A method for manufacturing a wiring board, comprising: preparing a first multilayer wiring board comprising a plurality of first conductive layers and having a first pad on a surface of the first multilayer wiring board; preparing a second multilayer wiring board comprising a plurality of second conductive layers and having a second pad on a surface of the second multilayer wiring board; setting the surface of the first multilayer wiring board and the surface of the second multilayer wiring board such that the first pad and the second pad face each other; forming a penetrating hole in an adhesive layer comprising an adhesive sheet such that the penetrating hole has a hole diameter which is made greater than diameters of the first and second pads such that the penetrating hole has a clearance between the first pad and the penetrating hole and a clearance between the second pad and the penetrating hole; and interposing the adhesive layer between the surface of the first multilayer wiring board and the surface of the second multilayer wiring board such that the first multilayer wiring board and the second multilayer wiring board are adhered through the adhesive layer, that the first pad and the second pad face each other across the adhesive layer and that the penetrating hole connects the first pad and the second pad, wherein the interposing of the adhesive layer includes filling the clearance between the penetrating hole and the first pad with resin and filling the clearance between the penetrating hole and the second pad with resin. ### Claim 20 (depends on 19) The method for manufacturing the wiring board according to claim 19, wherein at least one of the first multilayer wiring board and the second multilayer wiring board comprises a plurality of filled vias comprising plated materials and having truncated cone shapes, the plurality of filled vias is formed such that the truncated cone shapes are tapering in a lamination direction of the at least one of the first multilayer wiring board and the second multilayer wiring board and connect at least one of the plurality of first conductive layers and the plurality of the second conductive layers, and the at least one of the first pad and the second pad is formed to make contact with a surface of the one of the filled via conductors in contact such that the surface of the one of the filled via conductors in contact is a surface having a larger diameter of a truncated cone shape. ### Claim 21 (depends on 19) The method for manufacturing the wiring board according to claim 19, further comprising: preparing a third multilayer wiring board comprising a plurality of third conductive layers and having a third pad on a surface of the third multilayer wiring board; setting a second surface of the first multilayer wiring board and the surface of the third multilayer wiring board such that the third pad and a pad on the second surface of the first multilayer wiring board to face each other; and interposing between the second surface of the first multilayer wiring board and the surface of the third multilayer wiring board a second adhesive layer comprising an adhesive sheet such that the first multilayer wiring board and the third multilayer wiring board are adhered through the second adhesive layer and that the third pad and the pad on the second surface of the first multilayer wiring board face each other across the second adhesive layer. ### Claim 22 (depends on 21) The method for manufacturing the wiring board according to claim 21, wherein the plurality of second conductive layers in the second multilayer wiring board and the plurality of third conductive layers in the third multilayer wiring board have different numbers of conductive layers. ### Claim 23 (depends on 19) The method for manufacturing the wiring board according to claim 19, wherein the resin filling the clearance between the penetrating hole and the clearance between the penetrating hole and the second pad is derived from the adhesive layer. ### Claim 24 (depends on 19) The method for manufacturing the wiring board according to claim 19, further comprising forming a bonding layer connecting the first pad and the second pad in the penetrating hole.