# US 9,040,831 B2 · Manufacturing method for printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,831 B2 - Document ID: US9040831B2 - Status: Granted - Kind: B2 - Application number: 14/023,965 - Filed: 2013-09-11 - Published: 2014-03-27 - Granted: 2015-05-26 - Earliest claimed: 2012-09-27 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Mitsuya Ishida; Hiroyuki Mori - Web page: https://patentgrep.com/patent/US9040831B2 ## CPC - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/0298: {Multilayer circuits} - H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards} - H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/46: Manufacturing multilayer circuits - H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil} - H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)} - H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)} - Y10T 29/49162: by using wire as conductive path - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A printed circuit board is manufactured by forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly, forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly, forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer, forming a second metal layer on the wall surface of the grooves in the wiring structure portion, and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board. ## Claims ### Claim 1 A printed circuit board assembly comprising: a first metal layer formed upon a top surface of a support base in a predetermined pattern, the first metal layer defines boundary ends between adjacent printed circuit boards in the printed circuit board assembly; a wiring structure portion formed upon the top of the first metal layer, the wiring structure portion comprising an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly; grooves formed in the wiring structure portion, the grooves having a pattern corresponding to the first metal layer pattern to expose the first metal layer; a second metal layer formed upon a wall surface of the grooves. ### Claim 2 (depends on 1) The printed circuit board assembly of claim 1, wherein the grooves are formed in the wiring structure portion using a laser drill. ### Claim 3 (depends on 1) The printed circuit board assembly of claim 1, wherein the second metal layer further comprises: a metal film formed on an inside surface of the grooves and on a surface of the wiring structure portion, and; a mask layer formed on the metal film, the mask layer comprising an opening in the grooves. ### Claim 4 (depends on 1) The printed circuit board assembly of claim 1, wherein the first metal layer is cut on a bottom surface of the grooves to separate each printed circuit board using a dicer. ### Claim 5 A manufacturing method for a printed circuit board comprising: forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly; forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly; forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer; forming a second metal layer on the wall surface of the grooves in the wiring structure portion; and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board. ### Claim 6 (depends on 5) The method according to claim 5, wherein forming the grooves in the wiring structure portion further comprises: forming the grooves in the wiring structure portion using a laser drill. ### Claim 7 (depends on 5) The method according to claim 5, wherein forming the second metal layer on the wall surface of the grooves in the wiring structure portion further comprises: forming a metal film on the inside surface of the grooves and on the surface of the wiring structure portion using electroless metal plating; forming on the metal film a mask layer having an opening in the grooves; forming the second metal layer on the metal film inside the grooves using electrolytic metal plating; and removing the mask layer, and then removing the metal film by etching the entire metal surface. ### Claim 8 (depends on 5) The method according to claim 5, wherein cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board further comprises: piece-cutting the first metal film using a dicer.