# US 9,040,606 B2 · Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent

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- Number: US 9,040,606 B2
- Document ID: US9040606B2
- Status: Granted
- Kind: B2
- Application number: 13/499,923
- Filed: 2010-10-07
- Published: 2012-08-09
- Granted: 2015-05-26
- Earliest claimed: 2009-10-20
- Assignees: Sumitomo Bakelite Co., Ltd.
- Applicants: Junichi Tabei
- Inventors: Junichi Tabei
- Web page: https://patentgrep.com/patent/US9040606B2

## CPC

- H10W 74/47: comprising organic materials, e.g. plastics or resins
- C08G 59/621: {Phenols}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- C08L 23/18: Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L 35/00: Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L 2203/206: use in coating or encapsulating of electronic parts
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/732: {between stacked chips}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/752: {between stacked chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an α-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.

## Claims

### Claim 1

A semiconductor device comprising a copper-containing lead frame and a semiconductor element,
wherein the semiconductor element is encapsulated with a cured product of an epoxy resin composition for encapsulating a semiconductor,
wherein the epoxy resin composition comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a mold releasing agent,
said mold releasing agent contains a compound (D) having a copolymer of an α olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms;
the compound (D) contains the copolymer of α-olefin having 43 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms; and
a content of said compound (D) having the copolymer of α-olefin having 28 to 60 carbon atoms and maleic anhydride esterified with the long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms is equal to or more than 55% by mass and equal to or less than 100% by mass, based on 100% by mass of the total amount of said mold releasing agent.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, the epoxy resin composition further comprising a siloxane addition polymer modified product represented by the following general formula (I):
wherein in the formula:
R1 to R2 are selected from a hydrogen atom, a substituted or unsubstituted hydrocarbon group having 1 to 55 carbon atoms, an alkyleneoxy glycidyl ether group and an alkylene oxide group, and all are the same or different from each other;
R3 to R4 are selected from a hydrogen atom, a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, an amino group, a carboxyl group, a glycidyl ether group, and an alkylcarboxylic acid-4,4′(1-methylethylidene)bisphenol diglycidyl ether group, and all are the same or different from each other; and
n represents an integer of from 1 to 100.

### Claim 3 (depends on 2)

The semiconductor device according to claim 2, wherein the content of said siloxane addition polymer modified product is equal to or more than 0.1% by mass and equal to or less than 2% by mass, based on 100% by mass of the total amount of said epoxy resin composition.

### Claim 4 (depends on 1)

The semiconductor device according to claim 1, wherein said epoxy resin (A) comprises at least one kind of resin selected from the group consisting of a biphenyl type epoxy resin, a paraxylylene type epoxy resin and a phenol aralkyl type epoxy resin having a biphenylene skeleton.

### Claim 5 (depends on 1)

The semiconductor device according to claim 1, wherein the compound (D) contains the copolymer of the α-olefin having 50 carbon atoms and the maleic anhydride esterified with a long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms.

### Claim 6 (depends on 1)

The semiconductor device according to claim 1, wherein the
compound (D) contains the copolymer of the α-olefin having 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms.

### Claim 7 (depends on 1)

The semiconductor device according to claim 1, wherein the number average molecular weight of the compound (D) is equal to or more than 2,000 and equal to or less than 10,000.

### Claim 8 (depends on 1)

The semiconductor device according to claim 1, wherein the mixing amount of the compound (D) is equal to or more than 1% by mass and equal to or less than 5% by mass, based on 100% by mass of the total amount of the epoxy resin (A).

### Claim 9 (depends on 1)

The semiconductor device according to claim 1, wherein the compound (D)
contains the copolymer of α-olefin having 50 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic monohydric alcohol having 12 to 22 carbon atoms.