# US 9,040,359 B2 · Molded interposer package and method for fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,359 B2 - Document ID: US9040359B2 - Status: Granted - Kind: B2 - Application number: 14/482,112 - Filed: 2014-09-10 - Published: 2014-12-25 - Granted: 2015-05-26 - Earliest claimed: 2012-01-04 - Assignees: Mediatek Inc. - Applicants: MediaTek Inc. - Inventors: Thomas Matthew Gregorich; Andrew C. Chang; Tzu-Hung Lin - Web page: https://patentgrep.com/patent/US9040359B2 ## CPC - H10W 90/00: Package configurations - H10W 70/635: {Through-vias} - H10W 74/01: Manufacture or treatment - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/072: {of bump connectors} - H10W 72/07232: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07236: {Soldering or alloying} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/271: {the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/732: {between stacked chips} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet, forming a molding material covering the top surface, filling the first recesses, forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface, forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias, performing a second anisotropic etching process to remove a portion of the metal sheet from a bottom surface of the metal sheet until a bottom of the molding material is exposed, and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed. ## Claims ### Claim 1 A method for fabricating a molded interposer package, comprising: providing a metal sheet having a top surface and a bottom surface; performing a first anisotropic etching process to remove a portion of the metal sheet from the top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; forming a molding material covering the top surface of the metal sheet, filling the first recesses; forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface of the metal sheet; forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias; performing a second anisotropic etching process to remove a portion of the metal sheet from the bottom surface of the metal sheet until a bottom of the molding material is exposed; and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed. ### Claim 2 A method for fabricating a molded interposer package, comprising: providing a metal sheet having a top surface and a bottom surface; mounting a carrier on the bottom surface of the metal sheet; performing an anisotropic etching process to remove a portion of the metal sheet from the top surface of the metal sheet until the carrier is exposed, thereby forming a plurality of vias through the metal sheet; filling a molding material into the vias, leaving the top surface of the metal sheet exposed; removing the carrier; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. ### Claim 3 A method for fabricating a molded interposer package, comprising: providing a mold chase; loading a plurality of the metal lumps in the mold chase, wherein upper portions and lower portions of the metal balls are embedded in the mold chase; filling a molding material into the mold chase to encapsulate the metal lumps; taking off the mold chase, leaving the upper portions and the lower portions of the metal lumps exposed; removing the exposed upper portions and the lower portions of the metal lumps over a top surface and a bottom surface of the molding material; forming a passivation layer on the top surface of the molding material, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. ### Claim 4 (depends on 3) The method for fabricating the molded interposer package as claimed in claim 3, wherein the metal lumps are ball-shape or studded shape. ### Claim 5 (depends on 1) The method for fabricating the molded interposer package as claimed in claim 1, further comprising: forming a plurality of conductive bumps extending through the solder mask layer pattern to directly connect to the first metal vias or the first redistribution layer patterns; bonding a chip on the conductive bumps to connect to the first metal vias or the first redistribution layer patterns; and forming a plurality of solder balls on the bottom surfaces of the metal lumps. ### Claim 6 (depends on 2) The method for fabricating the molded interposer package as claimed in claim 2, further comprising: forming a plurality of conductive bumps extending through the solder mask layer pattern to directly connect to the first metal vias or the first redistribution layer patterns; bonding a chip on the conductive bumps to connect to the first metal vias or the first redistribution layer patterns; and forming a plurality of solder balls on the bottom surfaces of the metal lumps. ### Claim 7 (depends on 3) The method for fabricating the molded interposer package as claimed in claim 3, further comprising: forming a plurality of conductive bumps extending through the solder mask layer pattern to directly connect to the first metal vias or the first redistribution layer patterns; bonding a chip on the conductive bumps to connect to the first metal vias or the first redistribution layer patterns; and forming a plurality of solder balls on the bottom surfaces of the metal lumps. ### Claim 8 (depends on 5) The method for fabricating the molded interposer package as claimed in claim 5, further comprising disposing an underfill material on the solder mask layer pattern where the chip is bonded thereto. ### Claim 9 (depends on 6) The method for fabricating the molded interposer package as claimed in claim 6, further comprising disposing an underfill material on the solder mask layer pattern where the chip is bonded thereto. ### Claim 10 (depends on 7) The method for fabricating the molded interposer package as claimed in claim 7, further comprising disposing an underfill material on the solder mask layer pattern where the chip is bonded thereto. ### Claim 11 (depends on 8) The method for fabricating the molded interposer package as claimed in claim 8, wherein the underfill material has a solid or a liquid state. ### Claim 12 (depends on 9) The method for fabricating the molded interposer package as claimed in claim 9, wherein the underfill material has a solid or a liquid state. ### Claim 13 (depends on 10) The method for fabricating the molded interposer package as claimed in claim 10, wherein the underfill material has a solid or liquid state.