# US 9,040,356 B2 · Semiconductor including cup-shaped leadframe packaging techniques > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,356 B2 - Document ID: US9040356B2 - Status: Granted - Kind: B2 - Application number: 12/487,666 - Filed: 2009-06-19 - Published: 2009-10-15 - Granted: 2015-05-26 - Earliest claimed: 1999-12-10 - Assignees: Vishay-Siliconix - Applicants: Mike Chang; King Owyang; Yueh-Se Ho; Mohammed Kasem; Lixiong Luo; Wei-Bing Chu - Inventors: Mike Chang; King Owyang; Yueh-Se Ho; Mohammed Kasem; Lixiong Luo; Wei-Bing Chu - Web page: https://patentgrep.com/patent/US9040356B2 ## CPC - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 74/111: {the semiconductor body being completely enclosed} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die. ## Claims ### Claim 1 A method of fabricating a semiconductor package comprising electrically coupling a first side of a die to a first portion of a cup shaped lead frame such that a surface of a second portion of the cup shaped lead frame along two edges of the die is coplanar with a second side of the die but not electrically coupled to a terminal of the second side of the die and the second portion of the cup shaper lead frame along the other two edges of the die is not coplanar with a second side of the die, wherein the first side of the die is oppositely disposed from the second side of the die, and wherein the second portion of the cup shaped lead frame includes a plurality of individual leads along each of the two edges of the die. ### Claim 2 (depends on 1) The method according to claim 1, wherein the first side of the die and the first portion of the cup shaped lead frame are electrically coupled by depositing a conductive epoxy or cement between the first side of the die and the first portion of the cup shaped lead frame. ### Claim 3 (depends on 1) The method according to claim 1, further comprising encapsulating the cup shaped lead frame and die such that the terminal on the second side of the die and the second portion of the cup shaped lead frame are exposed. ### Claim 4 (depends on 3) The method according to claim 3, wherein the encapsulant covers the first portion of the cup shaped lead frame. ### Claim 5 (depends on 3) The method according to claim 3, wherein the encapsulant does not cover the first portion of the cup shaped lead frame. ### Claim 6 (depends on 3) The method according to claim 3, wherein the encapsulant is injected between the die and a third portion of the cup shaped lead frame coupling the first and second portion of the cup shaped lead frame, and wherein holes between each of the plurality of individual leads in the second portion allow the encapsulant to fill a space between the third portion of the cupped lead frame and the die. ### Claim 7 (depends on 3) The method according to claim 3, wherein encapsulating the cup shaped lead frame and the die comprises injection molding plastic. ### Claim 8 (depends on 1) The method according to claim 1, further comprising forming the cup shaped lead frame wherein a third portion couples the first portion to the second portion to form a cup to hold the die. ### Claim 9 (depends on 8) The method according to claim 8, further comprising forming the cup shaped lead frame wherein the second portion includes the plurality of individual leads. ### Claim 10 (depends on 1) The method according to claim 1, wherein the second side of the die includes one or more additional terminals. ### Claim 11 A method of fabricating a semiconductor package comprising attaching a first surface of a semiconductor die to a first portion of a lead frame using a conductive epoxy wherein the lead frame is cupped to define a recess sized to accommodate the semiconductor die and wherein a second portion of the cup shaped lead frame includes a plurality of individual leads along each of two edges of the semiconductor die and each individual lead having a mounting surface coplanar with the second surface of the semiconductor die but not electrically coupled to the second surface of the semiconductor die. ### Claim 12 (depends on 11) The method according to claim 11, further comprising encapsulating the lead frame and the semiconductor die, wherein the second portion of the lead frame and the second surface of the semiconductor die are exposed. ### Claim 13 (depends on 11) The method according to claim 11, further comprising forming the lead frame wherein the first portion of the lead frame is adapted to attached to the first surface of the semiconductor die and wherein the second portion of the lead frame is adapted to he coplanar with the second surface of the semiconductor die. ### Claim 14 (depends on 11) The method according to claim 11, further comprising electrically coupling the second portion of the lead frame and the second surface of the semiconductor die to a printed circuit board. ### Claim 15 A semiconductor package comprising: a die including a first side and a terminal on a second side, wherein the second side is oppositely disposed from the first side; and a cupped lead frame including a first portion electrically coupled to the first side of the die, a surface of each of a plurality of individual leads of a second portion of the cupped lead frame along each of two edges of the die disposed coplanar to a surface of the second side of the die but electrically isolated from the terminal on the second side of the die, and a third portion extending between the first and second portion. ### Claim 16 (depends on 15) The semiconductor package of claim 15, wherein the first portion of the cupped lead frame is electrically coupled to the first side of the die by a conductive epoxy. ### Claim 17 (depends on 15) The semiconductor package of claim 15, further comprising an encapsulant mechanically coupling the die and the cupped lead frame. ### Claim 18 (depends on 17) The semiconductor package of claim 17, wherein the encapsulant is disposed between the third portion of the cupped lead frame and the die. ### Claim 19 (depends on 18) The semiconductor package of claim 18, wherein the encapsulant is further disposed over the first portion of the cupped lead frame. ### Claim 20 (depends on 15) The semiconductor package of claim 15, wherein the cupped lead frame thermally couples the first side of the die to a printed circuit board. ### Claim 21 (depends on 15) The semiconductor package of claim 15, wherein the cupped lead frame and the terminal on the second side of the die electrically couple the die to a printed circuit board. ### Claim 22 (depends on 21) The semiconductor package of claim 21, wherein the cupped lead frame and the terminal on the second side of the die mechanically couple the die to the printed circuit board. ### Claim 23 (depends on 15) The semiconductor package of claim 15, further comprising one or more additional terminals on the second side of the die. ### Claim 24 (depends on 17) The semiconductor package of claim 17, wherein holes between each of the plurality of leads in the second portion allow the encapsulant to fill a space between the third portion of the cupped lead frame and the die.