# US 9,040,347 B2 · Fan-out high-density packaging methods and structures

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- Number: US 9,040,347 B2
- Document ID: US9040347B2
- Status: Granted
- Kind: B2
- Application number: 13/984,889
- Filed: 2012-03-22
- Published: 2013-11-28
- Granted: 2015-05-26
- Earliest claimed: 2011-03-22
- Assignees: Nantong Fujitsu Microelectronics Co., Ltd.
- Applicants: Yujuan Tao; Lei Shi
- Inventors: Yujuan Tao; Lei Shi
- Web page: https://patentgrep.com/patent/US9040347B2

## CPC

- H10W 70/685: comprising multiple insulating layers
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/69: Insulating materials thereof
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H05K 2201/0154: Polyimide
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/10674: Flip chip
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/07507: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/874: {On different surfaces}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A fan-out high-density packaging method includes providing a packaging substrate, forming a stripping film on the packaging substrate, and forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer. The method also includes forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings, forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer, and forming at least one package layer on the second protection layer. Each of at least one package layer includes a straight mounting layer, a sealant layer, and a wiring layer formed in sequence, and the package layer connects the metal redistribution layer through the wiring layer. Further, the method includes forming at least one top-level package layer on top of the at least one package layer, removing the packaging substrate and the stripping film to expose the metal redistribution layer in the first protection layer, and planting metal solder balls on the exposed metal redistribution layer.

## Claims

### Claim 1

A method for fan-out high-density packaging, comprising:
providing a packaging substrate;
forming a stripping film on the packaging substrate;
forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer;
forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings;
forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer;
forming at least one package layer on the second protection layer, wherein each of at least one package layer includes a straight mounting layer, a sealant layer, and a wiring layer formed in sequence, and the package layer connects the metal redistribution layer through the wiring layer;
forming at least one top-level package layer on top of the at least one package layer;
removing the packaging substrate and the stripping film to expose the metal redistribution layer in the first protection layer; and
planting metal solder balls over the exposed metal redistribution layer.

### Claim 2 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein planting metal solder balls over the exposed metal redistribution layer further includes:
forming an under-the-ball metal layer on the exposed metal redistribution layer; and
forming metal solder balls on the under-the-ball metal layer.

### Claim 3 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein forming the top-level package layer further includes:
forming at least one flip package layer on top of the at least one package layer, wherein the flip package layer includes a flip mounting layer, an underfill, and a sealant layer.

### Claim 4 (depends on 3)

The method for fan-out high-density packaging according to claim 3, wherein:
the at least one package layer and the top-level package layer are interconnected through the wiring layer of the at least one package layer and the solder bumps.

### Claim 5 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein forming the top-level package layer further includes:
forming at least one wire-bonding package layer on top of the at least one package layer, wherein the wire-bonding package layer includes a straight mounting layer, metal wires, and a sealant layer.

### Claim 6 (depends on 5)

The method for fan-out high-density packaging according to claim 5, wherein:
the at least one package layer and the top-level package layer are interconnected through the wiring layer of the at least one package layer and the metal wires.

### Claim 7 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein forming at least one package layer on the second protection layer further includes:
attaching a first straight mounting layer on the second protection layer at an opposite side of a functional surface of the first straight mounting layer;
forming a first sealant layer on the second protection layer on a same side attached with the first straight mounting layer and exposing bonding pads of the first straight mounting layer;
forming a first wiring layer including first vertical metal wiring connecting the metal redistribution layer and a first horizontal metal wiring layer connecting the first vertical metal wiring, wherein the first vertical metal wiring is formed by forming first vias in the first sealant layer and filling conductive material in the first vias and the first horizontal metal wiring layer is formed on the first sealant layer;
stacking a second straight mounting layer on the first sealant layer;
forming a second sealant layer on the first sealant layer covering the second straight mounting layer and exposing bonding pads of the second straight mounting layer; and
forming a second wiring layer including second vertical metal wiring connecting the first wiring layer and a second horizontal metal wiring layer connecting the second vertical metal wiring; wherein the second vertical metal wiring is formed by forming second vias in the second sealant layer and filling conductive material in the second vias, and the second horizontal metal wiring layer is formed on the second sealant layer.

### Claim 8 (depends on 7)

The method for fan-out high-density packaging according to claim 7, wherein forming the flip package layer on the second package layer further includes:
flipping at least one chip with solder bumps onto the second horizontal metal wiring layer on the second sealant layer to form the flip mounting layer, wherein the solder bumps are used connect the flip mounting layer and the second wiring layer;
forming an underfill by filling space between the chip in the flip mounting layer and the second sealant layer with a filler; and
forming a third sealant layer on the second sealant layer covering the flip mounting layer and encapsulating the flip mounting layer.

### Claim 9 (depends on 8)

The method for fan-out high-density packaging according to claim 8, wherein:
the filler in the underfill is made of polymer epoxy.

### Claim 10 (depends on 7)

The method for fan-out high-density packaging according to claim 7, wherein forming the wire-bonding package layer on the second package layer further includes:
forming at least one chip with functional surface facing up on the second package layer to form the straight mounting layer;
connecting bonding pads of the chip in the straight mounting layer to the second package layer with wires using wire-bonding process; and
forming a third sealant layer on the second sealant layer covering the straight mounting layer such that the straight mounting layer and the metal wires are encapsulated by the third sealant layer.

### Claim 11 (depends on 7)

The method for fan-out high-density packaging according to claim 7, wherein:
each of the first mounting layer and the second mounting layer includes at least one of a chip group and a passive device group;
the chip group includes one or more chips; and
the passive device group includes any one or more of capacitors, resistors, and inductors.

### Claim 12 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein:
the packaging substrate is a silica wafer or a glass substrate.

### Claim 13 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein:
the stripping film is made of a UV glue and formed the stripping film is formed by spin-coating or printing.

### Claim 14 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein:
the protecting layer is made of polyimide or benzocyclobutene.

### Claim 15 (depends on 1)

The method for fan-out high-density packaging according to claim 1, wherein:
the sealant layer is made of epoxy and formed by turn injection, compression, or printing.