# US 9,040,325 B2 · Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers

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- Number: US 9,040,325 B2
- Document ID: US9040325B2
- Status: Granted
- Kind: B2
- Application number: 14/248,340
- Filed: 2014-04-09
- Published: 2014-08-07
- Granted: 2015-05-26
- Earliest claimed: 2011-07-08
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Advanced Optoelectronic Technology, Inc.
- Inventors: Hou-Te Lin; Chao-Hsiung Chang
- Web page: https://patentgrep.com/patent/US9040325B2

## CPC

- H10H 29/14: comprising multiple light-emitting semiconductor components
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10W 90/00: Package configurations
- H10H 20/036: {of packages}
- H10H 20/0362: {of encapsulations}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip.

## Claims

### Claim 1

A method for manufacturing an LED (light emitting diode) package comprising following steps:
providing an electrically insulated base, the base having a first surface and a second surface opposite to the first surface;
forming an annular voltage stabilizing module on the first surface of the base;
forming a first electrode on the first surface of the base, the first electrode being attached to and encircled by the voltage stabilizing module;
forming a second electrode on the first surface of the base, the second electrode being attached to and encircling the voltage stabilizing module;
mounting at least one LED chip on the first electrode, the at least one LED chip being electrically connected to the first and second electrodes, the at least one LED chip and the voltage stabilizing module being connected in reverse parallel; and
encapsulating the at least one LED chip with an encapsulative layer.

### Claim 2 (depends on 1)

The method of claim 1, wherein the voltage stabilizing module comprises a first doping layer and a second doping layer, the first and second doping layers being respectively doped with two different or two kinds of different elements, whereby the first doping layer being a P-type doping layer and the second doping layer being an N-type doping layer.

### Claim 3 (depends on 2)

The method of claim 2, wherein the first doping layer is attached to and encircles the second doping layer, and the second doping layer is attached to and encircles the first electrode.

### Claim 4 (depends on 3)

The method of claim 3, wherein the second electrode is attached to and encircles the first doping layer.

### Claim 5 (depends on 2)

The method of claim 2, wherein an annular protrusion is formed on the first surface of the base via microlithography and etching, and the first doping layer and the second doping layer are formed by the protrusion via a doping process.

### Claim 6 (depends on 5)

The method of claim 5, wherein the doping process is epitaxial dope, diffusing dope or ion-implantation.

### Claim 7 (depends on 1)

The method of claim 1, wherein the base is made of the following one or more than one of the materials: Si, GaAs, ZnO and InP.

### Claim 8 (depends on 1)

The method of claim 1, wherein the second electrode bends and extends to the second surface of the base.

### Claim 9 (depends on 1)

The method of claim 1, wherein the first electrode penetrates through and extends to the second surface of the base, the first and second electrodes are electrically insulated from each other on the second surface of the base.