# US 9,040,228 B2 · Method for forming patterns of semiconductor device by using mixed assist feature system

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- Number: US 9,040,228 B2
- Document ID: US9040228B2
- Status: Granted
- Kind: B2
- Application number: 14/225,380
- Filed: 2014-03-25
- Published: 2014-07-24
- Granted: 2015-05-26
- Earliest claimed: 2008-06-18
- Assignees: SK hynix Inc.
- Applicants: SK hynix Inc.
- Inventors: Jeon Kyu Lee
- Web page: https://patentgrep.com/patent/US9040228B2

## CPC

- G03F 1/38: Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F 1/36: Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
- G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A method for forming patterns of a semiconductor device includes providing a photomask that includes an array of contact holes in an active region, a plurality of first dummy contact holes for restricting pattern distortion of the contact holes in an area outside of the array of the contact holes, a plurality of first assist features for restricting pattern distortion of the first dummy contact holes disposed inside a corresponding one of the first dummy contact holes, and an array of second assist features for additionally restricting pattern distortion of the first dummy contact holes. The array of second assist features is disposed outside of the first dummy contact holes. The method also includes forming an array of contact holes and first dummy contact holes on a wafer by using the photomask as an exposure mask.

## Claims

### Claim 1

A method for forming patterns of a semiconductor device, comprising:
providing a photomask that includes:
an array of contact holes in an active region;
a plurality of first dummy contact holes for restricting pattern distortion of the array of contact holes in an area outside of the array of contact holes;
a plurality of first assist features for restricting pattern distortion of the first dummy contact holes, each of the first assist features being inserted inside a corresponding one of the first dummy contact holes; and an array of second assist features for additionally restricting pattern distortion of the first dummy contact holes, the array of second assist features being disposed outside of the first dummy contact holes;
and
forming said patterns on a wafer by using the photomask as an exposure mask.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first dummy contact holes have the same shape as that of contact holes in the array of contact holes, but have a larger critical dimension than that of contact holes in the array of contact holes,
wherein the photomask further comprises an array of second dummy contact holes having the same shape as that of the contact holes and a critical dimension that is between those of the first dummy contact holes and the contact holes.

### Claim 3 (depends on 2)

The method of claim 2, wherein each of the first assist features is set to a solid body pattern when each of the first dummy contact holes is set to a space pattern.

### Claim 4 (depends on 1)

The method of claim 1, wherein the second assist features comprises bar patterns extending in a direction perpendicular to the arranged direction of the dummy contact holes.